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  • journal of welding and joining(223)
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[Search Query: (Kojic:DHOJBN) AND (Publication Year:[2006 TO 2008])]

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No Article Title /Author/Journal Title/Publication Year Cited
Study on the Optimization of Pulse GTAW Process for Diaphragm with Thin Thickness/
[Park, Hyoung-Jin;Hwang, In-Sung;Kang, Mun-Jin;Rhee, Se-Hun;] / Journal of Welding and Joining / 2008     		1
Effects of Nd:YAG Laser Welding Parameters on Fatigue life of Lap Joint Structure in Stainless Steel/
[Kim, Yang;Yang, Hyun-Seok;Park, Ki-Young;Lee, Kyoung-Don;] / Journal of Welding and Joining / 2008     		1
A Characteristics of the Multiple Repair Welding HAZs in a Low Alloy-Steel(2.25Cr-1.0Mo)/
[Lee, Chul-Ku;Ahn, Jong-Seok;Lee, Nam-Hyuck;Lee, Gil-Jae;] / Journal of Welding and Joining / 2008     		1
Au-Sn Flip-chip Bumping Technology and Reliability for Optoelectronic Packaging/
[Yoon, Jeong-Won;Kim, Jong-Woong;Koo, Ja-Myeong;Noh, Bo-In;Jung, Seung-Boo;] / Journal of Welding and Joining / 2008     		2
High-Density Electronic Packaging Technology using Anisotropic Conductive Adhesives/
[Lee, Jin-Woon;Lee, Seong-Hyuk;Kim, Jong-Min;] / Journal of Welding and Joining / 2008     		0
Ultra-Thinned Si Wafer Processing for Wafer Level 3D Packaging/
[Choi, Mi-Kyeung;Kim, Eun-Kyung;] / Journal of Welding and Joining / 2008     		2
Electrical Characterization of Electronic Package/
[Kim, Jong-Woong;Koo, Ja-Myeong;Yoon, Jeong-Won;Noh, Bo-In;Jung, Seung-Boo;] / Journal of Welding and Joining / 2008     		0
Solder Bumping for Flip Chip Bonding/
[Jung, Jae-Pil;Lee, Hee-Yul;Cheon, Ji-Hun;] / Journal of Welding and Joining / 2008     		0
Design of Ultrasonic Welding Horn/
[Yoo, Choong-D.;] / Journal of Welding and Joining / 2008     		0
Precipitation and Precipitate Coarsening Behavior According to Nb Addition in the Weld HAZ of a Ti-containing Steel/
[Moon, Joon-Oh;Lee, Chang-Hee;] / Journal of Welding and Joining / 2008     		0