In the remote welding system using $CO_2$ laser, laser beam is rapidly deflected by moving mirrors of scanner system and has focusable distance over 1000mm from workpiece. From such arrangement, various advantages and disadvantages arise. Remote welding is a highly efficient laser process. As the mirrors of the scanner system allow positioning speeds exceeding 700m/s, it becomes possible to reduce the welding cycle time. On the other hand, as there no the provision of shielding gas which is normally required for beam powers exceeding 3kW, may become difficult task. Therefore, In this study, the influence of the various penetration of back bead by the different laser welding speed on the weld seam formation without shielding gas was investigated.

Auto focusing system to find optimized focal position of laser beam used for material process has been investigated by using fiber confocal method. Wavelength of laser diode (LD) and diameter of single-mode fiber we 780nm and $5.3{\mu}m$, respectively. Intensity distributions of beam reflected from the surface of mirror and silicon bare wafer have been observed in a gaussian form. Experimental results show that focal position obtained by LD is shifted from one observed from surface scribed by laser about $80{\mu}m$. It is due to the difference of wavelength and each divergence of between LD and laser used for material process. It is confirmed that auto focusing control system through position calibration has operated steadily.

This study is about the spectroscopic characterization of abnormal cells in a macro to micro approach. In the first step a commercial UV-Vis apparatus is used, which is ultimately altered to the limits to decrease detection volume. In the ultimate stage an infrared femtosecond laser setup is used to measure on individual cells.

A COG(Chip on Glass) bonding process that is one of display packaging technology and bonds between driver IC chip and a glass panel using ACF(Anisotropic Conductive Film)has been investigated by using diode laser. This method is possible to raise cure temperature of ACF within one second and can reduce the total process time for COG bonding by a conventional method such as a hot plate. Also we can get good pressure mark on the surface of electrodes and higher bonding strength than that by convention method. Results show that laser COG bonding can give low pressure bonding and decrease a warpage of panel. We believe that it can be applied to fine pitch module.

In this study, manufacturing of polymer master, PDMS(poly dimethylsiloxane) transfer mold, and mold insert was investigated for laser LIGA(LIthography Calvanoformung Abformtechnik). Initially, ablation by excimer laser radiation was used successfully to make 3-D microstructure of PET. After then, the PDMS transfer mold was replicated using ablated PET. Finally, epoxy resin tooling on replicated PDMS transfer mold was executed for making mold insert. From these facts we can conclude that excimer laser ablation of polymer and fabricaiton of PDMS transfer mold are reasonable tools to substitute for X-ray lithography of LIGA process in microstructuring.

Decapsulation of EMC(Epoxy Molding Compound) in package device is a method used to inspect inside of device by removing plastic molding. So far, chemical etching and mechanical grinding methods have been used widely. Recently, several works using laser have been carried out. This method has advantages with fast process time and precision than conventional methods because of noncontact process. Also, laser process is a clean process because of removing EMC directly without using toxic chemicals. The wavelength of laser used in this study is 355nm. Key parameters of removing EMC are laser power, scan speed, and number of scans of laser. It if confirmed that laser decapsulation is a useful process to inspect inside a device with a small thermal damage to chip surface.

Diffraction grating is the optical device which has periodic pattern. Decorative logotypes is the one of application of diffraction grating. In this paper diffraction grating for decorative logotype is fabricated by dot pattern in stead of line pattern. A metallic mold for diffraction gratings is fabricated with a mode-locked 12 ps $Nd:YVO_4$ laser. Laser pulses with a wavelength of 355nm are irradiated on the surface of NOK 80, a mold material, to generate dot patterns. In order to minimize the dot diameter, laser power is set just above the ablation threshold of NOK 80. Results show that the spectrum from the fabricated mold is good enough for some industrial application.

Hybrid type microscope with a Scanning Confocal Microscope (SCM) and a shear-force Atomic Force Microscope (AFM) is suggested and preliminarily studied. A image of $120{\times}120{\mu}m^2$ is obtained within 1 second by SCM because scan speed of a X-axis and Y-axis are 1kHz and 1Hz, respectively. Shear-force AFM is able to correctly measure the hight and width of sample with a resolution 8nm. However, the scan speed is slow and it is difficult to distinguish a surface composed of different kinds of materials. We have carried out the measurement of total image of a sample by SCM and an exact analysis of each image by shear-force AFM.

Low-k wafer engraving process has been investigated by using UV pico-second laser with high repetition rate. Wavelength and repetition rate of laser used in this study are 355nm and 80MHz, respectively. Main parameters of low-k wafer engraving processes are laser power, work speed, assist gas flow rate, and protective coating to eliminate debris. Results show that engraving qualities of low-k layer by using UV pico-second pulse width and high repetition rate had better kerf edge and higher work speed, compared to one by conventional laser with nano-second pulse width and low repetition rate in the range of kHz. Assist gas and protective coating to eliminate debris gave effects on the quality of engraving edge. Total engraving width and depth are obtained less than $20{\mu}m$ and $10{\mu}m$ at more than 500mm/sec work speed, respectively. We believe that engraving method by using UV pico-second laser with high repetition rate is useful one to give high work speed of laser material process.