과제정보
This work was supported by the Kwangwoon Univeristy in 2023, the Korea Institute for Advancement of Technology (KIAT) (P0012451) funded by the MOTIE and the Korea Evaluation Institute Of Industrial Technology (KEIT)(RS2022-00154720).
참고문헌
- Kimoto T., Jpn, J, Appl. Phys., 2015, 54, 040103-1-040103-27. https://doi.org/10.7567/JJAP.54.040103
- Jinseon Lee, Tai Young Kang and Kyung Hwan Kim., Electrical Characteristics of the SiC SBD Prepared by using the Facing Targets Sputtering Method. Journal of the semiconductor & display technology, 14(1), 27-30, 2015.
- Dongjin Kim, Junghwan Bang and Min-Su Kim., Advances in Power Semiconductor Devices for Automotive Power Inverters: SiC and GaN., The Microelectronics And Packaging Society, 30(2), 43-51, 2023.
- R. Perez et al., "A highly effective edge termination design for SiC planar high power devices," Mater. Sci. Forum, vols. 457-460, pp. 1253-1256, Jun. 2004. https://doi.org/10.4028/www.scientific.net/MSF.457-460.1253
- S. H. Ryu, S. Krishnaswami, B. Hull, J. Richmond, A. Agarwal, and A. Hefner, "10 kV, 5A 4H-SiC power DMOSFET," in Proc. Int. Symp. Power Semicond. Devices ICs, 2006, pp. 265-268.
- Koutarou Kawahara, Jun Suda, Gerhard Pensl, et al., J. Appl. Phys. 108, 033706 (2010).