Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Plasma Application Technology of FOWLP (Fan-out Wafer Level Packaging) Process

FOWLP(Fan-out Wafer Level Packaging) 공정의 플라즈마 응용 기술

  • Se Yong Park (Dept. of Advanced Materials Eng., Tech University of Korea) ;
  • Seong Eui Lee (Dept. of Advanced Materials Eng., Tech University of Korea) ;
  • Hee Chul Lee (Dept. of Advanced Materials Eng., Tech University of Korea) ;
  • Sung Yong Kim (Dept. of Electronics Eng., Tech University of Korea) ;
  • Nam Sun Park (JESAGI HANKOOK LTD.) ;
  • Kyoung Min Kim (Dept. of Advanced Materials Eng., Tech University of Korea)
  • 박세용 (한국공학대학교 신소재공학과) ;
  • 이성의 (한국공학대학교 신소재공학과) ;
  • 이희철 (한국공학대학교 신소재공학과) ;
  • 김성용 (한국공학대학교 전자공학과) ;
  • 박남선 ((주)제4기한국) ;
  • 김경민 (한국공학대학교 신소재공학과)
  • Received : 2023.03.20
  • Accepted : 2023.03.30
  • Published : 2023.03.30
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Abstract

Recently, there has been an increasing demand for performance improvement and miniaturization in response to the growing variety of signals and power demands in many industries such as mobile, IoT, and automotive. As a result, there is a high demand for high-performance chips and advanced packaging technologies that can package such chips. In this context, the FOWLP process technology is a suitable technology, and this paper discusses the plasma application technologies that are being used and studied to improve the shortcomings of this process. The paper is divided into four parts, with an introduction and case studies for each of the plasma application technologies used in each part.

최근 모바일, IoT, 차량 등의 많은 산업군에서 발생하는 다양한 종류의 신호 및 전력 요구가 증가함에 따라 그에 맞는 성능 향상과 소형화에 대한 요구가 높아지고 있는 상황이다. 이러한 추세에 따라 고성능의 칩이 필요해지고 이러한 칩을 패키징 할 수 있는 고급 패키지 기술의 개발 필요성이 높아지고 있는 상황이다. 이러한 상황에서 FOWLP 공정 기술은 이에 맞는 적합한 기술이며 이 공정에서의 부족한 점을 개선하기 위하여 사용되고 연구되고 있는 플라즈마 응용 기술들에 대하여 본 논문에서 알아보았으며 크게 4가지 부분으로 나누어 각 부분에서 사용되는 플라즈마 응용 기술들에 대한 소개와 연구 사례를 설명한다.

Keywords

Acknowledgement

이 성과는 정부(산업통산자원부)의 재원으로 한국 산업기술평가관리원의 (Grant No. 20011427, 2023)과 (Grant No. 20011196, 2022)의 지원을 받아 수행된 연구임

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