Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Development Trend of Ni-less Surface Treatment Technology for Semiconductor Packaging Substrates

반도체 패키지 기판용 Ni-less 표면처리 기술 개발동향

  • Min-Kyo Cho (Department of Material Engineering, Tech University of Korea) ;
  • Jin-Ki Cho (Department of Material Engineering, Tech University of Korea) ;
  • Kyoung-Min Kim (Department of Material Engineering, Tech University of Korea) ;
  • Sung Yong Kim (Dept. of Electronics Eng., Tech University of Korea) ;
  • Deok-Gon Han (MK Chem & Tech Co., Ltd) ;
  • Tae-Hyun Sung (MK Chem & Tech Co., Ltd)
  • 조민교 (한국공학대학교 신소재공학과) ;
  • 조진기 (한국공학대학교 신소재공학과) ;
  • 김경민 (한국공학대학교 신소재공학과 ) ;
  • 김성용 (한국공학대학교 전자공학부) ;
  • 한덕곤 ((주)엠케이켐앤텍) ;
  • 성태현 ((주)엠케이켐앤텍)
  • Received : 2023.03.20
  • Accepted : 2023.03.30
  • Published : 2023.03.30
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Abstract

Recently, System in Packaging(SIP) technology needs to meet high frequency (5G and more) communication technology and fine pitch surface treatment. The conventional Electroless Ni/Immersion Au plating(ENIG) is not suitable for high frequency range because of magnetic properties are increasing the transmission loss. Without nickel plating layer, the pattern and pad reliability level must be meet the condition. In this review paper, we investigated research trends on Ni-less surface treatment technology for high-frequency communication and frequency characteristics according to materials.

최근 SIP (System in Packaging) 기술은 고주파(5G 이상) 통신 및 미세 피치 회로 특성을 만족해야 한다. 기존 ENIG (Electroless Ni/Immersion Au Plating) 표면처리는 전송 손실이 증가하여 고주파에 적합하지 않으므로, 니켈 도금층이 없어도 패턴 및 패드의 신뢰성 수준을 만족시킬 수 있는 표면 처리 기술이 검토되고 있다. 본 논문에서는 고주파 통신 대응을 위한 Ni-less 표면처리기술과 소재에 따른 주파수 특성 등에 대한 연구 동향을 조사하였다.

Keywords

Acknowledgement

이 성과는 정부(산업통상자원부)의 재원으로 한국산업기술진흥원의 "월드클래스플러스 (R&D, P171000005)" 사업의 지원을 받아 수행된 연구임

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