Acknowledgement
이 연구는 2022년 산업통상자원부 및 한국산업기술평가관리원(KEIT) 연구비 지원에 의하여 수행 되었습니다. (20006956, 열충격 2000cycle 이상 신뢰성을 갖는 모바일용 내충격 언더필 소재 및 접합모듈 기술 개발)
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