과제정보
This work was supported by Korea Institute of Energy Technology Evaluation and Planning(KETEP) grant funded by the Korea government(MOTIE)(20202020800360, Innovative Energy Remodeling Total Technologies(M&V, Design, Package Solutions, and Testing & Verifications Technologies) for the Aging Public Buildings). Also, this work was supported by Korea Institute of Energy Technology Evaluation and Planning(KETEP) grant funded by the Korea government (MOTIE)(20212020800090, Development and Demonstration of Energy-Efficiency Enhanced Technology for TemperatureControlled Transportation and Logistics Center).
참고문헌
- E. R. Hnatek, "Integrated circuit quality and reliability", CRC Press, 808 (1995).
- A. S. Oates, "Interconnect Reliability Challenges for Technology Scaling: A Circuit Focus", 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), IEEE, 16140092 (2016).
- X. J. Fan and E. Suhir, "Moisture sensitivity of plastic packages of IC devices", Springer, USA (2010).
- A. A. O. Tay, "Modeling of interfacial delamination in plastic IC packages under hygrothermal loading", J. Electron. Packag., 127(3), 265-275 (2005).
- X. Fan, G. Q. Zhang, W. D. van Driel, and L. J. Ernst, "Interfacial delamination mechanisms during soldering reflow with moisture preconditioning", IEEE Transactions on Components and Packaging Technologies, 31(2), 252-259 (2008). https://doi.org/10.1109/TCAPT.2008.921629
- A. A. O. Tay and T. Y. Lin, "Influence of temperature, humidity, and defect location on delamination in plastic IC packages", IEEE Transactions on Components and Packaging Technologies, 22(4), 512-518 (1999). https://doi.org/10.1109/6144.814966
- S. K. Tran, D. L. Questad, and B. G. Sammakia, "Adhesion issues in flip-chip on organic modules", IEEE Transactions on Components and Packaging Technologies, 22(4), 519-524 (1999). https://doi.org/10.1109/6144.814967
- S. Yoon, B. Han, S. Cho, and C. -S. Jang, "Non-linear finite element analysis for electronic packages subjected to combined hygroscopic and thermo-mechanical stresses", 2005 7th Electronic Packaging Technology Conference, IEEE, 569-574 (2005).
- D. K. Shin, J. J. Lee, C. K. Yoon, G. J. Lee, J. K. Hong, and N. S. Kim, "Development of single cantilever beam method to measure the adhesion of thin film adhesive on silicon chip", Engineering Fracture Mechanics, 133, 179-190 (2015).
- X. Chen, S. Zhao, and L. Zhai, "Moisture absorption and diffusion characterization of molding compound", J. Electron. Packag., 127(4), 460-465 (2005). https://doi.org/10.1115/1.2065707
- Z. Huo, M. Mohamed, J. R. Nicholas, X. Wang, and K. Chandrashekhara, "Experimentation and simulation of moisture diffusion in foam-cored polyurethane sandwich structure", Journal of Sandwich Structures & Materials, 18(1), 30-49 (2016). https://doi.org/10.1177/1099636215582218
- C. -H. Shen and G. S. Springer, "Moisture absorption and desorption of composite materials", Journal of Composite Materials, 10(1), 2-20 (1976). https://doi.org/10.1177/002199837601000101
- H. -S. Kim, J. Huh, and J. Ryu, "Investigation of moistureinduced delamination failure in a semiconductor package via multi-scale mechanics", Journal of Physics D: Applied Physics, 44(3), 034007 (2010).
- H. -S. Kim and H. G. Song, "Investigation of moistureinduced failures of stacked-die package", Microelectronics Reliability, 47(9-11), 1673-1679 (2007). https://doi.org/10.1016/j.microrel.2007.07.014
- L. Ma, R. Joshi, K. K. Newman, and X. Fan, "Improved finite element modeling of moisture diffusion considering discontinuity at material interfaces in electronic packages", 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), IEEE, 18990801 (2019).