Acknowledgement
이 논문은 충북대학교 국립대학육성사업(2021)지원을 받아 작성되었습니다.
References
- F. Wang, D. Li, Z. Zhang, M. Wu, and C. Yan, "Improvement on interfacial structure and properties of Sn-58Bi/Cu joint using Sn-3.0Ag-0.5Cu solder as barrier", J. Mater. Sci.: Mater. Electron., 28(24), 19051-19060 (2017). https://doi.org/10.1007/s10854-017-7859-5
- K. Suganuma, "Advances in lead-free electronics soldering", Curr. Opin. Solid State Mater. Sci., 5(1), 55-64 (2001). https://doi.org/10.1016/S1359-0286(00)00036-X
- H. Ma, and J. C. Suhling, "A review of mechanical properties of lead-free solders for electronic packaging, J. Mater. Sci., 44(5), 1141-1158 (2009). https://doi.org/10.1007/s10853-008-3125-9
- C. Zhang, S. D. Liu, G. T. Qian, Z. H. O. U. Jian, and X. U. E. Feng, "Effect of Sb content on properties of Sn-Bi solders", Trans. Nonferrous Met. Soc. China, 24(1), 184-191 (2014). https://doi.org/10.1016/s1003-6326(14)63046-6
- O. Mokhtari, and H. Nishikawa, "Effects of In and Ni addition on microstructure of Sn-58Bi solder joint", J. Electron. Mater., 43(11), 4158-4170 (2014). https://doi.org/10.1007/s11664-014-3359-z
- R. S. Sidhu, R. Aspandiar, S. Vandervoort, D. Amir, and G. Murtagian, "Impact of processing conditions and solder materials on surface mount assembly defects", JOM., 63(10), 47-51 (2011). https://doi.org/10.1007/s11837-011-0174-3
- Z. Zhao, C. Chen, C. Y. Park, Y. Wang, L. Liu, G. Zou, and Q. Wang, "Effects of package warpage on head-in-pillow defect", Mater. Trans., 56(7), 1037-1042 (2015). https://doi.org/10.2320/matertrans.MI201404
- Z. Zhu, Y. C. Chan, and F. Wu, "Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing", Microelectron. Reliab., 91, 179-182 (2018).
- K. N. Tu, Y. Liu, and M. Li, "Effect of Joule heating and current crowding on electromigration in mobile technology", Appl. Phys. Rev., 4(1), 011101 (2017). https://doi.org/10.1063/1.4974168
- D. Xie, D. Shangguan, D. Geiger, D. Gill, V. Vellppan, and K. Chinniah, "Head in pillow (HIP) and yield study on SIP and PoP assembly", Proc. 2009 59th IEEE Electronic Components and Technology Conference (ECTC), California, 752, IEEE Components, Packaging and Manufacturing Technology Society (CPMT) (2009).
- L. T. Chen, and C. M. Chen, "Electromigration study in the eutectic SnBi solder joint on the Ni/Au metallization", J. Mater. Res., 21(4), 962-969 (2006). https://doi.org/10.1557/jmr.2006.0113
- H. W. Miao, J. G. Duh, and B. S. Chiou, "Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder joints", J. Mater. Sci.: Mater. Electron., 11(8), 609-618 (2000). https://doi.org/10.1023/a:1008928729212
- F. Wang, H. Chen, Y. Huang, L. Liu, and Z. Zhang, "Recent progress on the development of Sn-Bi based low-temperature Pb-free solders", J. Mater. Sci.: Mater. Electron., 30(4), 3222-3243 (2019). https://doi.org/10.1007/s10854-019-00701-w
- J. E. Lee, K. S. Kim, and S. H. Huh, "Development of SnZn Based Low Temperature Lead-Free Solder for Improvement of Oxidation Resistance (in Kor.)", JWJ, 29(5), 16-23 (2011).
- R. Raj, P. Shrivastava, N. Jindal, S. N. Alam, N. Naithani, M. Padhy, and M. M. Abbas, "Development and characterization of eutectic Sn-Zn, Sn-Ag, Sn-Bi and Sn-Cu solder alloys", J. Mater. Res., 110(12), 1150-1159 (2019). https://doi.org/10.3139/146.111851
- L. Pu, Y. Huo, X. Zhao, K. N. Tu, and Y. Liu, "Undercooling and microstructure analysis for the design of low melting point solder", Proc. 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), Chengdu, 1, IEEE Electronic Devices Society (EDS) (2021).
- S. Cheng, C. M. Huang, and M. Pecht, "A review of lead-free solders for electronics applications", Microelectron. Reliab., 75, 77-95 (2017). https://doi.org/10.1016/j.microrel.2017.06.016
- J. H. Park, J. C. Park, S. Shin, and K. W. Paik, "Low-Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers", IEEE Trans. Compon. Packaging Manuf. Technol., 9(11), 2152-2159 (2019). https://doi.org/10.1109/tcpmt.2019.2945016
- W. R. Osorio, L. C. Peixoto, L. R. Garcia, N. Mangelinck-Noel, and A. Garcia, "Microstructure and mechanical properties of Sn-Bi, Sn-Ag and Sn-Zn lead-free solder alloys", J. Alloys Compd., 572, 97-106 (2013). https://doi.org/10.1016/j.jallcom.2013.03.234
- S. Liu, Z. Liu, L. Liu, T. Song, W. Liu, Y. Tan, Z. San, and S. Huang, "Electromigration behavior of Cu/Sn-58Bi-1Ag/Cu solder Joints by ultrasonic soldering process", J. Mater. Sci.: Mater. Electron., 31(15), 11997-12003 (2020). https://doi.org/10.1007/s10854-020-03817-6
- Z. Mei, and J. W. Morris, "Characterization of eutectic SnBi solder joints", J. Electron. Mater., 21(6), 599-607 (1992). https://doi.org/10.1007/BF02655427
- S. Liu, T. Song, W. Xiong, L. Liu, and S. Huang, "Effects of Ag on the microstructure and shear strength of rapidly solidified Sn-58Bi solder", J. Mater. Sci.: Mater. Electron., 30(7), 6701-6707 (2019). https://doi.org/10.1007/s10854-019-00981-2
- H. E. Peng, X. C. Lu, T. S. Lin, H. X. Li, A. N. Jing, M. A. Xin, and Y. Y. Qian, "Improvement of mechanical properties of Sn-58Bi alloy with multi-walled carbon nanotubes", Trans. Nonferrous Met. Soc. China, 22, 692-696 (2012).
- L. Yang, W. Zhou, Y. Ma, X. Li, Y. Liang, W. Cui, and P. Wu, "Effects of Ni addition on mechanical properties of Sn58Bi solder alloy during solid-state aging", Mater. Sci. Eng. A, 667, 368-375 (2016). https://doi.org/10.1016/j.msea.2016.05.015
- Y. Wei, Y. Liu, L. Zhang, and X. Zhao, "Effects of endogenous Al and Zn phases on mechanical properties of Sn58Bi eutectic alloy", Mater. Charact., 175, 111089 (2021). https://doi.org/10.1016/j.matchar.2021.111089
- D. P. Jiang, Z. X. Yao, L. M. Yin, G. Wang, D. Li, and X. K. Tian, "Effect of minor Ag and Cu additions on melting characteristics, wettability and microstructures of Sn58Bi solder", Proc. 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin, 1098, IEEE Components, Packaging and Manufacturing Technology Society (CPMT) (2017).
- C. J. Lee, K. D. Min, H. J. Park, and S. B. Jung, "Mechanical properties of Sn-58wt% Bi solder containing Ag-decorated MWCNT with thermal aging tests", J. Alloys Compd., 820, 153077 (2020). https://doi.org/10.1016/j.jallcom.2019.153077
- X. Liu, M. Huang, C. M. L. Wu, and L. Wang, "Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder", J. Mater. Sci.: Mater. Electron., 21(10), 1046-1054 (2010). https://doi.org/10.1007/s10854-009-0025-y
- R. M. Shalaby, "Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi-Sn based lead-free solder alloys", Mater. Sci. Eng. A, 560, 86-95 (2013). https://doi.org/10.1016/j.msea.2012.09.038
- H. Kang, B. Baek, and J. P. Jung, "Recent Low Temperature Solder of SnBi and Its Bonding Characteristics (in Kor.)", JWJ, 38(6), 576-583 (2020).
- Y. Maruya, H. Hata, I. Shohji, and S. Koyama, "Bonding characteristics of Sn-57Bi-1Ag low temperature lead-free solder to gold-plated copper", Procedia Eng., 184, 223-230 (2017). https://doi.org/10.1016/j.proeng.2017.04.089
- M. McCormack, H. S. Chen, G. W. Kammlott, and S. Jin, "Significantly improved of Bi-Sn solder alloys mechanical properties by Ag-doping", J. Electron. Mater., 26(8), 954-958 (1997). https://doi.org/10.1007/s11664-997-0281-7
- Z. Wang, Q. K. Zhang, Y. X. Chen, and Z. L. Song, "Influences of Ag and In alloying on Sn- Bi eutectic solder and SnBi/Cu solder joints", J. Mater. Sci.: Mater. Electron., 30(20), 18524-18538 (2019). https://doi.org/10.1007/s10854-019-02206-y
- W. Dong, Y. Shi, Z. Xia, Y. Lei, and F. Guo, "Effects of trace amounts of rare earth additions on microstructure and properties of Sn-Bi-based solder alloy", J. Electron. Mater., 37(7), 982-991 (2008). https://doi.org/10.1007/s11664-008-0458-8
- M. Li, Y. Tang, Z. Li, M. Zhu, and W. Wang, "Microstructure and mechanical properties of Sn-58Bi eutectic alloy with Cu/P addition", Mater. Res. Express., 7(11), 116502 (2020). https://doi.org/10.1088/2053-1591/abc4f8
- Q. S. Zhu, H. Y. Song, H. Y. Liu, Z. G. Wang, and J. K. Shang, "Effect of Zn addition on microstructure of Sn-Bi joint", Proc. 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPTHDP), Beijing, 1043, IEEE Components, Packaging and Manufacturing Technology Society (CPMT) (2009).
- S. Zhou, C. H. Yang, S. K. Lin, A. N. AlHazaa, O. Mokhtari, X. Liu, and H. Nishikawa, "Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy", Mater. Sci. Eng. A, 744, 560-569 (2019). https://doi.org/10.1016/j.msea.2018.12.012
- A. T. Tan, A. W. Tan, and F. Yusof, "Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/Cu solder joint during different thermal conditions", Sci. Technol. Adv. Mater., (2015).
- L. Yang, J. Dai, Y. Zhang, Y. Jing, J. Ge, and H. Liu, "Influence of BaTiO3 nanoparticle addition on microstructure and mechanical properties of Sn-58Bi solder", J. Electron. Mater., 44(7), 2473-2478, (2015). https://doi.org/10.1007/s11664-015-3796-3
- N. Hansen, "Hall-Petch relation and boundary strengthening", Scr. Mater., 51(8), 801-806 (2004). https://doi.org/10.1016/j.scriptamat.2004.06.002
- S. Tikale, and K. Narayan Prabhu, "Bond shear strength of Al2O3 nanoparticles reinforced 2220-capacitor/SAC305 solder interconnects reflowed on bare and Ni-coated copper substrate", J. Mater. Sci., 32(3), 2865-2886 (2021).
- N. Jiang, L. Zhang, Z. Q. Liu, L. Sun, M. Y. Xiong, M. Zhao, and K. K. Xu, "Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder", J. Mater. Sci.: Mater. Electron., 30(19), 17583-17590 (2019). https://doi.org/10.1007/s10854-019-02107-0
- A. Singh, R. Durairaj, and K. S. How, "Effect Of 3% Molybdenum (Mo) Nanoparticles on The Melting, Microstructure and Hardness Properties of As-Reflowed Low Mass Sn-58Bi (SB) Solder Alloy", J. Adv. Res. Fluid Mech. Therm. Sci., 77(1), 69-87 (2021) https://doi.org/10.37934/arfmts.77.1.6987
- B. Kim, H. Choi, H. Jeon, D. Lee, and Y. Sohn, "Mechanical Properties and Interfacial Reactions of Ru Nanoparticles Added Sn-58Bi Solder Joints (in Kor.)", J. Microelectron. Packag. Soc. 28(2), 95-103 (2021). https://doi.org/10.6117/KMEPS.2021.28.2.095
- Y. Li, and Y. C. Chan, "Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58BiAg composite solders", J. Alloys Compd., 645, 566-576 (2015). https://doi.org/10.1016/j.jallcom.2015.05.023
- T. Nishizawa, I. Ohnuma, and K. Ishida, "Examination of the Znenr relationship between grain size and particle dispersion", Mater. Trans. JIM, 38(11), 950-956 (1997). https://doi.org/10.2320/matertrans1989.38.950
- X. Li, Y. Ma, W. Zhou, and P. Wu, "Effects of nanoscale Cu6Sn5 particles addition on microstructure and properties of SnBi solder alloys", Mater. Sci. Eng. A, 684, 328-334 (2017). https://doi.org/10.1016/j.msea.2016.12.089
- L. Shen, P. Septiwerdani, and Z. Chen, "Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation", Mater. Sci. Eng. A, 558, 253-258 (2012). https://doi.org/10.1016/j.msea.2012.07.120
- D. Grivas, K. L. Murty, and J. W. Morris Jr, "Deformation of Pb Sn eutectic alloys at relatively high strain rates", Acta Metall., 27(5), 731-737 (1979). https://doi.org/10.1016/0001-6160(79)90106-8
- L. Yang, C. Du, J. Dai, N. Zhang, and Y. Jing, "Effect of nanosized graphite on properties of Sn-Bi solder" J. Mater. Sci.: Mater. Electron., 24(11), 4180-4185 (2013). https://doi.org/10.1007/s10854-013-1380-2
- L. Yang, W. Zhou, Y. Liang, W. Cui, and P. Wu, "Improved microstructure and mechanical properties for Sn58Bi solder alloy by addition of Ni-coated carbon nanotubes", Mater. Sci. Eng. A, 642, 7-15 (2015). https://doi.org/10.1016/j.msea.2015.06.080
- S. Amares, R. Durairaj, and S. H. Kuan, "Experimental Study on the Melting Temperature, Microstructural and Improved Mechanical Properties of Sn58Bi/Cu Solder Alloy Reinforced with 1%, 2% and 3% Zirconia (ZrO2) Nanoparticles", Arch. Metall. Mater., 66, 407-418 (2021).
- W. Zhu, Y. Ma, X. Li, W. Zhou, and P. Wu, "Effects of Al2O3 nanoparticles on the microstructure and properties of Sn58Bi solder alloys", J. Mater. Sci.: Mater. Electron., 29(9), 7575-7585 (2018). https://doi.org/10.1007/s10854-018-8749-1