과제정보
This work was supported by Korea Institute for Advancement of Technology (KIAT) grant funded by the Korea Government (MOTIE) (P0012451), Technology Innovation Program (20003540) and the excellent researcher support project of Kwangwoon University in 2022.
참고문헌
- Baliga, B. J. "Gallium nitride and silicon carbide power devices," World Scientific Publishing Company. 2016. DOI: 10.1142/10027
- Shur, M. "Wide band gap semiconductor technology: State-of-the-art," Solid-State Electronics, Vol.155, pp.65-75. 2019. DOI: 10.1016/j.sse.2019.03.020
- Pan, Y., Tian, L., Wu, H., Li, Y., & Yang, F. "3.3 kV 4H-SiC JBS diodes with single-zone JTE termination," Microelectronic Engineering, Vol.181, pp.10-15. 2017. DOI: 10.1016/j.mee.2017.05.054
- Liu, L., Wu, J., Ren, N., Guo, Q., & Sheng, K. "1200-V 4H-SiC merged pin Schottky diodes with high avalanche capability," IEEE Transactions on Electron Devices, Vol.67, No.9, pp.3679-3684, 2020. DOI: 10.1109/TED.2020.3007136
- Sharma, R. K., Hazdra, P., & Popelka, S. "The effect of light ion irradia-tion on 4H-SiC MPS power diode characteristics Experiment and simulation," IEEE Transactions on Nuclear Science, Vol.62, No.2, pp.534-541, 2015. DOI: 10.1109/TNS.2015.2395712
- Son, W. Y., Shin, M. C., Schweitz, M., Lee, S. K., & Koo, S. M. "Al Im-plantation and Post Annealing Effects in n-Type 4H-SiC," Journal of Nanoelectron-ics and Optoelectronics, Vol.15, No.7, pp.777-782, 2020. DOI: 10.1166/jno.2020.2818
- Sasaki, S., Kawahara, K., Feng, G., Alfieri, G., & Kimoto, T. "Major deep levels with the same microstructures observed in n-type 4H-SiC and 6H-SiC," Journal of Applied Physics, Vol.109, No.1, pp.013705. 2011. DOI: 10.1063/1.3528124
- Kawahara, K., Suda, J., Pensl, G., & Kimoto, T. "Reduction of deep levels generated by ion implantation into n-and p-type 4H-SiC," Journal of Applied Physics, Vol.108, No.3, pp.033706. 2010. DOI: 10.1063/1.3456159
- Jiang, Y., Sung, W., Song, X., Ke, H., Liu, S., Baliga, B. J., ... & Van Brunt, E. "10kV SiC MPS diodes for high temperature applications." In 2016 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD) IEEE. pp.43-46, 2016. DOI: 10.1109/ISPSD.2016.7520773
- Perez-Tomas, A., Brosselard, P., Hassan, J., Jorda, X., Godignon, P., Placidi, M., ... & Bergman, J. P. "Schottky versus bipolar 3.3 kV SiC diodes," Semiconductor Science and Technology, Vol.23, No.12, pp.125004, 2008. DOI: 10.1088/0268-1242/23/12/125004
- Cheung, S. K., & Cheung, N. W. "Extraction of Schottky diode parame-ters from forward current-voltage characteristics," Applied physics letters, Vol.49, No.2, pp.85-87. 1986. DOI: 10.1063/1.97359
- Padovani FA, Stratton R. Field and "Thermionic-field emission in Schottky Barriers," Solid-State Electron, Vol.9, No.7, pp.695-707, 1966. DOI: 10.1142/9789814503464_0053
- Roccaforte F, La Via F, Raineri V, Pierobon R, Zanoni E. "Richardson's constant in inhomogeneous silicon carbide Schottky contacts," J Appl Phys, Vol.93, No.11, pp.9137-44, 2003. DOI: 10.1063/1.1573750
- Lee, Y. J., Cho, S., Seo, J. H., Min, S. J., An, J. I., Oh, J. M., ... & Lee, D. "Electrical Characteristics of 4H-SiC Junction Barrier Schottky Diode," Journal of the Korean Institute of Electrical and Electronic Material Engineers, Vol.31, No.6, pp. 367-371, 2018. DOI: 10.4313/JKEM.2018.31.6.367
- Bellocchi, G., Vivona, M., Bongiorno, C., Badala, P., Bassi, A., Rascuna, S., & Roccaforte, F. "Barrier height tuning in Ti/4H-SiC Schottky diodes," Solid-State Electronics, Vol.186, pp.108042, 2021. DOI: 10.1016/j.sse.2021.108042
- Kyoung, S., Jung, E. S., & Sung, M. Y. "Post-annealing processes to improve inhomogeneity of Schottky barrier height in Ti/Al 4H-SiC Schottky barrier diode," Microelectronic Engineering, Vol.154, pp.69-73, 2016. DOI: 10.1016/j.mee.2016.01.013
- Pascu, R., Craciunoiu, F., Kusko, M., Draghici, F., Dinescu, A., & Danila, M. "The effect of the post-metallization annealing of Ni/n-type 4H-SiC Schottky contact," In CAS 2012 (International Semiconductor Conference) Vol.2, pp.457-460, 2012. DOI: 10.1109/SMICND.2012.6400732
- Skromme, B. J., Luckowski, E., Moore, K., Bhatnagar, M., Weitzel, C. E., Ge-hoski, T., & Ganser, D. "Electrical characteristics of Schottky barriers on 4H-SiC: The effects of barrier height nonuniformity," Journal of Electronic Materials, Vol.29, No.3, pp.376-383. 2000. DOI: 10.1007/s11664-000-0081-9
- Cabello, M., Soler, V., Rius, G., Montserrat, J., Rebollo, J., & Godignon, P. "Advanced processing for mobility improvement in 4H-SiC MOSFETs," A review. Materials Science in Semiconductor Processing, Vol.78, pp.22-31. 2018. DOI: 10.1016/j.mssp.2017.10.030
- R. T. Tung, "Electron transport at metal-semiconductor interfaces: general theory," Phys. Rev. B Vol.45, pp.13509, 1992. DOI: 10.1103/PhysRevB.45.13509
- Yakuphanoglu, F., & Senkal, B. F. "Electronic and thermoelectric prop-erties of polyaniline organic semiconductor and electrical characterization of Al/PANI MIS diode," The Journal of Physical Chemistry C, Vol.111, No.4, pp.1840-1846, 2007. DOI: 10.1021/jp0653050
- Dabrowska-Szata, M., Sochacki, M., & Szmidt, J. "Characterization of deep electron traps in 4H-SiC Junction Barrier Schottky rectifiers," Solid-State Electronics, Vol.94, pp.56-60, 2014. DOI: 10.1016/j.sse.2014.02.008
- Kawahara, K., Alfieri, G., & Kimoto, T. "Detection and depth analyses of deep levels generated by ion implantation in n-and p-type 4 H-SiC," Journal of Applied Physics, Vol.106, No.1, pp.013719. 2009. DOI: 10.1063/1.3159901
- Dalibor, T., Pensl, G., Matsunami, H., Kimoto, T., Choyke, W. J., Schoner, A., & Nordell, N. "Deep defect centers in silicon carbide monitored with deep level transient spectroscopy," physica status solidi (a), Vol.162, No.1, pp.199-225. 1997. DOI: 10.7471/ikeee.2022.26.1.50
- Kvamsdal, K. E. "Carbon vacancy engineering in p+ n 4H-SiC diodes by thermal processing," Master's thesis, 2019.
- Reshanov, S. A., Pensl, G., Danno, K., Kimoto, T., Hishiki, S., Ohshima, T., ... & Choyke, W. J. "Effect of the Schottky barrier height on the detection of midgap levels in 4 H-SiC by deep level transient spectroscopy," Journal of Applied Physics, Vol.102, No.11, pp.113702, 2007. DOI: 10.1063/1.2818050