반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

Wafer Packing Box 안정화 설계

Design Alterations of a Packing Box for the Semiconductor Wafer to Improve Stability

  • 윤재훈 (금오공과대학교 기계공학과) ;
  • 허장욱 (금오공과대학교 기계공학과) ;
  • 이일환 ((주)램시스템)
  • Yoon, Jae-Hoon (Department of Mechanical Engineering, Kumoh National Institute of Technology) ;
  • Hur, Jang-Wook (Department of Mechanical Engineering, Kumoh National Institute of Technology) ;
  • Yi, Il-Hwan (Ramsystem CO., LTD)
  • 투고 : 2022.02.21
  • 심사 : 2022.03.25
  • 발행 : 2022.03.31
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

Semiconductor is one of the most internationally competitive areas among domestic industries, the major concern of which is the stability of the wafer manufacturing processes. The packaging process is the final step in wafer manufacturing. Problems in the wafer packaging process cause large losses. The vibrations are supposed to be the most important factors for the packaging quality. In this study, the structure of a packaging box was analyzed through experiments and computer simulations, and further the effects of design alterations to suppress the vibrations have been investigated. The final result shows that the vibrations can be reduced substantially to improve the stability of the structure.

키워드

참고문헌

  1. Kim, E. Y. "A Comparative Analysis on Export Competitiveness of Semiconductor Industry between Korea and Related-Significant Countries", Journal of the Asian Studies, Vol 24, No 4, pp. 191-210(2021).
  2. Ro, S. H., "Design Alteration of a Milling Machine Structure for the Improved Stability", Journal of the Korean Society of Manufacturing Process Engineers, Vol. 5, pp. 72-78, (2006).
  3. Ro, S. H., and Park, Y. R.," Stability Design of a Laser Cutter for the Strengthened Glass", Journal of the Semiconductor & Display Technology, Vol. 14, No. 1, pp. 19-25, (2015).
  4. Yi, I. H., and Ro, S. H., "Structural Design of an Ingot Grower of the Semiconductor Wafer for the Stability Improvement", Journal of the Semiconductor & Display Technology, Vol. 16, No. 1, pp. 14-39, (2017).
  5. Shin, H. B., and Ro, S. H., "Design Alterations of a Squaring & Grinding Machine for the Solar Cell Wafer to Suppress Vibrations," Journal of the Semiconductor & Display Technology, Vol. 16, No. 3, pp. 25~30, (2017).
  6. Jae-Woo An, Optimum Design of a Eco-Friendly Servo Press for the Improved Pressing Accuracy, 13~47, (2010).
  7. Moon-Hyung Lee, Structural Design of Universal Cylindrical Grinder for the Improved Stability, 2~28, (2008).
  8. Yun-Ho Shin, Design optimization of a hydraulic press structure for the improved precision machining, 4~27, (2016).
  9. D.J Inman, Wiley, Chichester, U.K., Vibration and Control.(2006).