Acknowledgement
본 연구는 산업통상자원부의 재원으로 한국산업기술평가관리원 소재부품기술개발사업(20017189, 반도체소자 접합공정용 무시안 금 범프 소재 및 도금공정기술 개발)의 지원과 한국연구재단의 중견연구사업(2020R1A2C1014604, LCD구동 드라이버IC의 전극 형성용 친환경 금도금에 관한 연구)의 지원을 받아 수행된 연구로 연구비 지원에 감사드립니다.
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