반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

밀폐 형 전장 박스 온도 제어를 위한 히트 펌프 설계

Design of Heat Pump for Temperature Control of Sealed Electric Box

  • 이영태 (안동대학교 전자공학교육과)
  • Lee, Young Tae (Department of Electronics Education, Andong National University)
  • 투고 : 2020.06.26
  • 심사 : 2020.06.26
  • 발행 : 2020.06.30
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초록

In this paper, a heat pump using a Peltier device was developed for heat dissipation in a sealed electric box. The heat pump was designed with a cooling fin attached to both sides of the Peltier device, and a fan was mounted on the cooling fin on the hot side to increase the efficiency. The heat dissipation efficiency could be improved by directly connecting the electronic component having high heat to the cooling fin using a heat conducting wire. The fabricated heat pump was designed to operate only in the temperature range set by the temperature control system to improve the problem of high power consumption of the Peltier element.

키워드

참고문헌

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