Journal of Electrochemical Science and Technology

The Korean Electrochemical Society (한국전기화학회)
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Manufacturing of Copper(II) Oxide Powder for Electroplating from NaClO3 Type Etching Wastes

  • Hong, In Kwon (Department of Chemical Engineering, Dankook University) ;
  • Lee, Seung Bum (Department of Chemical Engineering, Dankook University) ;
  • Kim, Sunhoe (Department of New Energy & Resource Engineering, Sangji University)
  • Received : 2019.06.07
  • Accepted : 2019.08.23
  • Published : 2020.02.28
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Abstract

In this study, copper (II) oxide powder for electroplating was prepared by recovering CuCl2 from NaClO3 type etching wastes via recovered non-sintering two step chemical reaction. In case of alkali copper carbonate [mCuCo3·nCu(OH)2], first reaction product, CuCo3 is produced more than Cu(OH)2 when the reaction molar ratio of sodium carbonate is low, since m is larger than n. As the reaction molar ratio of sodium carbonate increased, m is larger than n and Cu(OH)2 was produced more than CuCO3. In the case of m has same values as n, the optimum reaction mole ratio was 1.44 at the reaction temperature of 80℃ based on the theoretical copper content of 57.5 wt. %. The optimum amount of sodium hydroxide was 120 g at 80℃ for production of copper (II) oxide prepared by using basic copper carbonate product of first reaction. At this time, the yield of copper (II) oxide was 96.6 wt.%. Also, the chloride ion concentration was 9.7 mg/L. The properties of produced copper (II) oxide such as mean particle size, dissolution time for sulfuric acid, and repose angle were 19.5 mm, 64 second, and 34.8°, respectively. As a result of the hole filling test, it was found that the copper oxide (II) prepared with 120 g of sodium hydroxide, the optimum amount of basic hydroxide for copper carbonate, has a hole filling of 11.0 mm, which satisfies the general hole filling management range of 15 mm or less.

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