반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

Position Control of Wafer Lift Pin for the Reduction of Wafer Slip in Semiconductor Process Chamber

  • Koo, Yoon Sung (Department of Electronic Engineering, Myongji University) ;
  • Song, Wan Soo (Department of Electronic Engineering, Myongji University) ;
  • Park, Byeong Gyu (Semiconductor Equipment Engineering Interdisciplinary Program, Myongji University) ;
  • Ahn, Min Gyu (Semiconductor Equipment Engineering Interdisciplinary Program, Myongji University) ;
  • Hong, Sang Jeen (Department of Electronic Engineering, Myongji University)
  • 투고 : 2020.10.30
  • 심사 : 2020.12.08
  • 발행 : 2020.12.31
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

Undetected wafer slip during the lift pin-down motion in semiconductor equipment may affect the center to edge variation, wafer warpage, and pattern misalignment in plasma equipment. Direct measuring of the amount of wafer slip inside the plasma process chamber is not feasible because of the hardware space limitation inside the plasma chamber. In this paper, we demonstrated a practice for the wafer lift pin-up and down motions with respect to the gear ratio, operating voltage, and pulse width modulation to maintain accurate wafer position using remote control linear servo motor with an experimentally designed chamber mockup. We noticed that the pin moving velocity and gear ratio are the most influencing parameters to be control, and the step-wised position control algorithm showed the most suitable for the reduction of wafer slip.

키워드

참고문헌

  1. C. Krueger, T. Feudel, V. Rao, A. Waite, Z. Zhao, S. Falk, and Y. Kim, "Achieving Uniform Device Performance by Using Advanced Process Control and SuperScanTM," AIP Conference Proceedings, Vol. 1321, No. 1, American Institute of Physics, 2011.
  2. S. Halder, Y. Mols, D. Heuvel , J. Puymbroeck, M. Caymax, E. Vancoille, and N. Nieuborg, "Progress on background signal analysis of bare wafer inspection systems based on light scattering for III/V epitaxial growth monitoring," 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014), pp. 283-287, 2014.
  3. F. Fang, A. Vaid, A. Vinslava, R. Casselberry, S. Mishra, D. Dixit, P. Timoney, D. Chu, C. Porter, D. Song, and Z. Ren, "Correlation study of actual temperature profile and in-line metrology measurements for within-wafer uniformity improvement and wafer edge yield enhancement," Metrology, Inspection, and Process Control for Microlithography XXXII, Vol. 10585, pp. 105851Q, 2018.
  4. E. Lee and M. Kim, "Evaluation of the Machining Method on the Formation of Surface Quality of Upper Electrode for Semiconductor Plasma Etch Process," Journal of the Semiconductor & Display Technology, Vol. 18, No. 4, pp. 1-5, 2019.
  5. X. Sun, Y. Zhang, X. Li, and Y. Wang, "Modulations of the plasma uniformity by low frequency sources in a large-area dual frequency inductively coupled plasma based on fluid simulations,"Physics of Plasmas, Vol. 22, No. 5, pp. 053508, 2015. https://doi.org/10.1063/1.4921670
  6. C. Huard, S. Lanham, and M. Kushner, "Consequences of atomic layer etching on wafer scale uniformity in inductively coupled plasmas," Journal of Physics D: Applied Physics, Vol. 51, No. 15, pp. 155201, 2018. https://doi.org/10.1088/1361-6463/aab322
  7. M. Chung and S. Lee, "Development of automatic wafer centering system for vacuum transfer robot using for semiconductor manufacturing," Applied Mechanics and Materials, Vol. 607, pp. 782-785, 2014. https://doi.org/10.4028/www.scientific.net/AMM.607.782
  8. C. Jung, W. Seo, and G. Kim, "A Study of Warpage Analysis According to Influence Factors in FOWLP Structure," Journal of the Semiconductor & Display Technology, Vol. 17, No. 4, pp. 42-45, 2018.
  9. Y. Cha, "The comparison experiment of rotation range of rc servo motors according to change of a periods," Journal of Institute of Control, Robotics and Systems, Vol. 17, No. 11, pp. 1179-1182, 2011. https://doi.org/10.5302/J.ICROS.2011.17.11.1179