한국기계가공학회지 (Journal of the Korean Society of Manufacturing Process Engineers)

  • 제18권9호
  • /
  • Pages.44-51
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  • 2019
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  • 1598-6721(pISSN)
  • /
  • 2288-0771(eISSN)
한국기계가공학회 (The Korean Society of Manufacturing Process Engineers)
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위상잠금 중파장 적외선 열화상 기법에 의한 결함 계측에서 측정 대상체의 재질에 따른 위상잠금 주파수 연구

Determination of Lock-in Frequency in Accordance with Material of Target for Defect Measuring by Lock-in Mid-IR Thermography

  • 박일철 (조선대학교 일반대학원 기계시스템미래자동차공학과) ;
  • 김상채 (조선대학교 일반대학원 기계시스템미래자동차공학과) ;
  • 이항서 (조선대학교 일반대학원 기계시스템미래자동차공학과) ;
  • 김한섭 (조선대학교 일반대학원 기계시스템미래자동차공학과) ;
  • 정현철 (조선대학교 산업기술융합대학원 융합자동차공학과) ;
  • 김경석 (조선대학교 기계시스템미래자동차공학부)
  • Park, Il-Chul (Dept. of Mechanical System & Automotive Engineering, Graduate School, Chosun UNIV.) ;
  • Kim, Sang-Chae (Dept. of Mechanical System & Automotive Engineering, Graduate School, Chosun UNIV.) ;
  • Lee, Hang-Seo (Dept. of Mechanical System & Automotive Engineering, Graduate School, Chosun UNIV.) ;
  • Kim, Han-Sub (Dept. of Mechanical System & Automotive Engineering, Graduate School, Chosun UNIV.) ;
  • Jung, Hyun-Chul (Dept. of Convergence Automotive Engineering, Graduate School of Industry Technology Convergence, Chosun UNIV.) ;
  • Kim, Kyeong-Suk (Dept. of Mechanical System & Automotive Engineering, Chosun UNIV.)
  • 투고 : 2019.07.23
  • 심사 : 2019.08.05
  • 발행 : 2019.09.30
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초록

Three types of samples with defects were measured by lock-in med-IR (infrared) thermography with various lock-in frequencies for different materials. The lock-in method can be used to detect defects when an external energy source is applied to the object, the non-uniformity of the incident thermal energy distribution is eliminated, and the camera's measurement cycle is synchronized with the load cycle of the incident energy source. For inspecting samples with defects, results of thermal images are analyzed when three types of materials, i.e., SM45C, STS316L, and AL6061 are tested and three lock-in frequencies, i.e., 0.08, 0.1, and 0.12 Hz are applied. In this study, the optimal lock-in frequencies were determined by comparing the results of each material and lock-in frequency measured using the mid-IR camera.

키워드

참고문헌

  1. Maldague, X. P., "Advances in signal processing for nondestructive evaluation of materials," Springer Science & Business Media, Vol. 262, 2012.
  2. Meola, C., "Infrared thermography recent advances and future trends," Bentham Science Publishers, pp. 60, 2012.
  3. Breitenstein, O., Langenkamp, M., "Lock-in thermography." Basics and Use for Functional Diagnostics of Electronics Components. Springer-Verlag Berlin Heidelberg, pp. 1-38, 2003.
  4. Park, J. H., Choi, M. Y., Kim, W. T., “Shearing phase lock-in infrared thermography for defects evaluation of metallic specimen,” Journal of the Korean Society for Nondestructive Testing, Vol. 30, No. 2, pp. 91-97, 2010.
  5. Kwon, D. J., Jung, N. R., Kim, J. Y., "Defect detection of carbon steel pipe weld area using infrared thermography camera," The Korean Society of Tribologists & Lubrication Engineers, Vol. 30, No. 2, pp. 124-129, 2014. https://doi.org/10.9725/kstle.2014.30.2.124
  6. Park, Y. H., Yang, S. M., “STS defect structure diagonis through the Infrared thermography mechanism and Flex-PDE thermal analysis,” Transactions of the Korean Society of Automotive Engineers, Vol. 22, No. 4, pp. 20-29, 2014. https://doi.org/10.7467/KSAE.2014.22.4.020
  7. Chung, Y. J., Kim, W. T., “Detectability study on subsurface defect evaluation of aluminum structures by using Lock-in thermography,” Journal of the Korean Society for Nondestructive Testing, Vol. 37, No. 4, pp. 262-268, 2017. https://doi.org/10.7779/JKSNT.2017.37.4.262
  8. Kim, S. C., Kang, S. H., Yun, N. Y., Jung, H. C., Kim, K. S., “A study about detection of defects in the nuclear piping loop system using cooling lock-in infrared thermography,” Journal of the Korean Society for Nondestructive Testing, Vol. 35, No. 5, pp. 321-331, 2015. https://doi.org/10.7779/JKSNT.2015.35.5.321
  9. Schmidt, C., Altmann, F., Schlangen, R., Deslandes, H., "Non-destructive defect depth determination at fully packaged and stacked die devices using lock-in thermography," 17th IEEE International Symposium on Physical and Failure Analysis of Integrated Circuits, pp. 1-5, 2010.
  10. Schlangen, R., Deslandes, H., Lundquist, T., Schmidt, C., Altmann, F., Yuc, K., Andreasyan, A., Li, S., "Dynamic lock-in thermography for operation mode-dependent thermally active fault localization," Microelectronics Reliability, Vol. 50, pp. 1454-1458, 2010. https://doi.org/10.1016/j.microrel.2010.07.082