Determination of Lock-in Frequency in Accordance with Material of Target for Defect Measuring by Lock-in Mid-IR Thermography
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Park, Il-Chul
(Dept. of Mechanical System & Automotive Engineering, Graduate School, Chosun UNIV.)
Kim, Sang-Chae (Dept. of Mechanical System & Automotive Engineering, Graduate School, Chosun UNIV.) Lee, Hang-Seo (Dept. of Mechanical System & Automotive Engineering, Graduate School, Chosun UNIV.) Kim, Han-Sub (Dept. of Mechanical System & Automotive Engineering, Graduate School, Chosun UNIV.) Jung, Hyun-Chul (Dept. of Convergence Automotive Engineering, Graduate School of Industry Technology Convergence, Chosun UNIV.) Kim, Kyeong-Suk (Dept. of Mechanical System & Automotive Engineering, Chosun UNIV.) |
1 | Maldague, X. P., "Advances in signal processing for nondestructive evaluation of materials," Springer Science & Business Media, Vol. 262, 2012. |
2 | Meola, C., "Infrared thermography recent advances and future trends," Bentham Science Publishers, pp. 60, 2012. |
3 | Breitenstein, O., Langenkamp, M., "Lock-in thermography." Basics and Use for Functional Diagnostics of Electronics Components. Springer-Verlag Berlin Heidelberg, pp. 1-38, 2003. |
4 | Park, J. H., Choi, M. Y., Kim, W. T., “Shearing phase lock-in infrared thermography for defects evaluation of metallic specimen,” Journal of the Korean Society for Nondestructive Testing, Vol. 30, No. 2, pp. 91-97, 2010. |
5 | Kwon, D. J., Jung, N. R., Kim, J. Y., "Defect detection of carbon steel pipe weld area using infrared thermography camera," The Korean Society of Tribologists & Lubrication Engineers, Vol. 30, No. 2, pp. 124-129, 2014. DOI |
6 | Park, Y. H., Yang, S. M., “STS defect structure diagonis through the Infrared thermography mechanism and Flex-PDE thermal analysis,” Transactions of the Korean Society of Automotive Engineers, Vol. 22, No. 4, pp. 20-29, 2014. DOI |
7 | Schlangen, R., Deslandes, H., Lundquist, T., Schmidt, C., Altmann, F., Yuc, K., Andreasyan, A., Li, S., "Dynamic lock-in thermography for operation mode-dependent thermally active fault localization," Microelectronics Reliability, Vol. 50, pp. 1454-1458, 2010. DOI |
8 | Chung, Y. J., Kim, W. T., “Detectability study on subsurface defect evaluation of aluminum structures by using Lock-in thermography,” Journal of the Korean Society for Nondestructive Testing, Vol. 37, No. 4, pp. 262-268, 2017. DOI |
9 | Kim, S. C., Kang, S. H., Yun, N. Y., Jung, H. C., Kim, K. S., “A study about detection of defects in the nuclear piping loop system using cooling lock-in infrared thermography,” Journal of the Korean Society for Nondestructive Testing, Vol. 35, No. 5, pp. 321-331, 2015. DOI |
10 | Schmidt, C., Altmann, F., Schlangen, R., Deslandes, H., "Non-destructive defect depth determination at fully packaged and stacked die devices using lock-in thermography," 17th IEEE International Symposium on Physical and Failure Analysis of Integrated Circuits, pp. 1-5, 2010. |
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