Fig. 1. Schematic illustration of π-type thermoelectric module.
Fig. 2. Fabrication process of thermoelectric elements from ingot and extrudate.
Fig. 3. Design of hot extrusion process.
Fig. 4. XRD patterns for Cu0.03Bi2Te2.7Se0.3 (a) powders and (b) extrudate.
Fig. 5. SEM images for the fractured surfaces of Cu0.03Bi2Te2.7Se0.3 extrudate; (a) perpendicular to the extrusion direction and (b) parallel to the extrusion direction.
Fig. 6. Temperature dependences of (a) electrical conductivity and Seebeck coefficient and (b) power factor for Cu0.03Bi2Te2.7Se0.3 extrudate.
참고문헌
- A. Sharma, J. H. Lee, K. H. Kim, and J. P. Jung, "Recent Advances in Thermoelectric Power Generation Technology", J. Microelectron. Packag. Soc., 24(1), 9 (2017). https://doi.org/10.6117/kmeps.2017.24.1.009
- G. J. Snyder and E. S. Toberer, "Complex Thermoelectric Materials", Nat. Mater., 7(2), 105 (2008). https://doi.org/10.1038/nmat2090
- D. H. Park, M. R. Roh, M. Y. Kim, and K. H. Song, "Reaction between Sn-3.5Ag Solder and Thin Film Metallization", J. Microelectron. Packag. Soc., 17(2), 49 (2010).
-
M. Kim, S. I. Kim, H. Cho, H. Mun, H. Kim, J. H. Lim, S. W. Kim, and K. H. Lee, "Cu-incorporation by melt-spinning in n-type
$Bi_2Te_{2.7}Se_{0.3}$ alloys for low-temperature power generation", Scripta Mater., 167, 120 (2019). https://doi.org/10.1016/j.scriptamat.2019.04.006 -
W. S. Kiu, Q. Zhang, Y. Lan, S. Chen, X. Yan, Q. Zhang, H. Wang, D. Wang, G. Chen, and Z. Ren, "Thermoelectric Property Studies on Cu-Doped n-type Cux
$Bi_2Te_{2.7}Se_{0.3}$ Nanocomposites", Adv. Energy Mater., 1, 577 (2011). https://doi.org/10.1002/aenm.201100149 -
Zhang, H. Wang, D. Wang, G. Chen, and Z. Ren, "Thermoelectric property studies on Cu-doped n-type Cux
$Bi_2Te_{2.7}Se_{0.3}$ nanocomposites", Adv. Energy Mater., 1(4), 577 (2011). https://doi.org/10.1002/aenm.201100149 -
J. Jiang, L. Chen, S. Bai, Q. Yao, and Q. Wang, "Thermoelectric properties of textured p-type
$(Bi,Sb)_2Te_3$ fabricated by spark plasma sintering", Scripta Mater., 52, 347 (2005). https://doi.org/10.1016/j.scriptamat.2004.10.038 - B. Poudel, Q. Hao, Y. Ma, Y. Lan, A. Minnich, B. Yu, X. Yan, D. Wang, A. Muto, D. Vashaee, X. Chen, J. Liu, M. S. Dresselhaus, G. Chen, and Z. Ren, "High-thermoelectric performance of nanostructured bismuth antimony telluride bulk alloys", Science, 320, 634 (2008). https://doi.org/10.1126/science.1156446
-
X. Yan, B. Poudel, Y. Ma, W. S. Liu, G. Joshi, H. Wang, Y. Lan, D. Wang, G. Chen, and Z. F. Ren, "Experimental studies on anisotropic thermoelectric properties and structures of n-Type
$Bi_2Te_{2.7}Se_{0.3}$ ", Nano Lett., 10(9), 3373 (2010). https://doi.org/10.1021/nl101156v -
S. M. Choi, K. H. Lee, Y. S. Lim, W. S. Seo, and S. Lee, "Effects of doping on the positional uniformity of the thermoelectric properties of n-type
$Bi_2Te_{2.7}Se_{0.3}$ polycrystalline bulks", J. Kor. Phys. Soc., 68(1), 17 (2016). https://doi.org/10.3938/jkps.68.17
피인용 문헌
- 반도체 재료의 격자열전도도 분석 vol.27, pp.4, 2020, https://doi.org/10.6117/kmeps.2020.27.4.061