References
- S. C. Siah, S. W. Lee, Y. S. Lee, J. Heo, T. Shibata, C. U. Segre, R. G. Gordon, and T. Buonassisi, Appl. Phys. Lett., 104, 242113 (2014). [DOI: https://doi.org/10.1063/1.4884115]
- P. K. Nayak, J. Jang, C. Lee, and Y. Hong, Appl. Phys. Lett., 95, 193503 (2009). [DOI: https://doi.org/10.1063/1.3262956]
- R. Vidya, P. Ravindran, and H. Fjellvag, Appl. Phys. Lett., 111, 123713 (2012). [DOI: https://doi.org/10.1063/1.4729774]
- C. S. Fuh, P. T. Liu, W. H. Huang, and S. M. Sze, IEEE Electron Device Lett., 35, 1103 (2014). [DOI: https://doi.org/10.1109/LED.2014.2354598]
- K. H. Lim, K. Kim, S. Kim, S. Y. Park, H. Kim, and Y. S. Kim, Adv. Mater., 25, 2994 (2013). [DOI: https://doi.org/10.1002/adma.201204236]
- M. Caglar, Y. Caglar, S. Aksoy, and S. Ilican, Appl. Surf. Sci., 256, 4966 (2010). [DOI: https://doi.org/10.1016/j.apsusc.2010.03.010]
- X. Sun, C. Zhou, M. Xie, H. Sun, T. Hu, F. Lu, S. M. Scott, S. M. Georgec, and J. Lian, J. Mater. Chem. A, 2, 7319 (2014). [DOI: https://doi.org/10.1039/C4TA00589A]
- M. Guziewicz, R. Schifano, E. Przezdziecka, J. Z. Domagala, W. Jung, T. A. Krajewski, and E. Guziewicz, Appl. Phys. Lett., 107, 101105 (2015). [DOI: https://doi.org/10.1063/1.4930307]
- A. Taube, M. Sochacki, N. Kwietniewski, A. Werbowy, S. Gieraltowska, L. Wachnicki, M. Godlewski, and J. Szmidt, Appl. Phys. Lett., 110, 143509 (2017). [DOI: https://doi.org/10.1063/1.4979872]
- J. F. Felix, M. Aziz, C.I.L. de Araujo, W. M. de Azevedo, V. Anjos, E. F. da Silva Jr, and M. Henini, Semicond. Sci. Technol., 29, 045021 (2014). [DOI: https://doi.org/10.1088/0268-1242/29/4/045021]
- K. Javaid, Y. F. Xie, H. Luo, M. Wang, H. L. Zhang, J. H. Gao, F. Zhuge, L. Y. Liang, and H. T. Cao, Appl. Phys. Lett., 109, 123507 (2016). [DOI: https://doi.org/10.1063/1.4963266]
- L. Fanni, B. A. Aebersold, D.T.L. Alexander, L. Ding, M. Morales-Masis, S. Nicolay, and C. Ballif, Thin Solid Films, 565, 1 (2014). [DOI: https://doi.org/10.1016/j.tsf.2014.06.033]
- G. Li, L. Yu, B. M. Hudak, Y. J. Chang, H. Baek, A. Sundararajan, D. R. Strachan, G. C. Yi, and B. S. Guiton, Mater. Res. Express, 3, 054001 (2016). [DOI: https://doi.org/10.1088/2053-1591/3/5/054001]
- J. A. Lee, Y. E. Lee, H. C. Lee, Y. W. Heo, J. H. Lee, and J. J. Kim, Ceram. Int., 42, 11170 (2016). [DOI: https://doi.org/10.1016/j.ceramint.2016.04.024]
- D. Wan, X. Liu, L. Xu, C. Liu, X. Xiao, S. Guo, and L. Liao, IEEE Electron Device Lett., 37, 50 (2016). [DOI: https://doi.org/10.1109/LED.2015.2501290]
- M. Jang, Y. Kim, J. Shin, and S. Lee, IEEE Electron Device Lett., 26, 354 (2005). [DOI: https://doi.org/10.1109/LED.2005.848074]