Fig. 1. Schematic illustration of the process flow for a locally stiffness-variant stretchable substrate consisting of soft PDMS, hard PDMS, and FPCB: (a) attach the acrylicsilicone double-sided tape to FPCB, (b) attach the FPCB to a partially cured hard PDMS using the silicone adhesive of the double-sided tape, (c) fully cure the hard PDMS, and (d) after placing the FPCB-bonded hard PDMS into a mold, pour and fully cure the soft PDMS.
Fig. 2. Schematic illustration of the stretchable substrate consisting of soft PDMS, hard PDMS, and FPCB after chip bonding.
Fig. 3. Engineering stress-strain (σ-ε) and true stress-strain (σt-εt) curves of (a) hard PDMS and (b) soft PDMS.
Fig. 4. Images of ink penetration into the delaminated interface between the FPCB and the fully cured hard PDMS, which were bonded together using the double-sided tape, at an applied tensile strain of (a) 3%, (b) 15%, (c) 22%, (d) 24%, (e) 28%, and (f) 30%.
Fig. 5. Pull strength of the FPCB bonded using the double-sided tape to the PDMS fully cured or partially cured for 15~25 minutes and then fully cured after bonding
Fig. 6. Optical images of the (a) FPCB side and (b) PDMS side after the pull test. The FPCB was bonded using the double-sided tape to the PDMS partially cured for 15 minutes before full curing of the PDMS..
Fig. 7. Optical images of the (a) FPCB side and (b) PDMS side after the pull test. The FPCB was bonded using the double-sided tape to the PDMS partially cured for 20 minutes before full curing of the PDMS.
Fig. 8. Optical images of the (a) FPCB side and (b) PDMS side after the pull test. The FPCB was bonded using the double-sided tape to the PDMS partially cured for 25 minutes before full curing of the PDMS.
Fig. 9. Images to illustrate the deformation behavior of the locally stiffness-variant stretchable substrate at an applied strain of (a) 0%, (b) 10%, (c) 20%, and (d) 30%.
Fig. 10. Actual strain of each part of the locally stiffness-variant stretchable substrate as a function of the applied tensile strain.
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