Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Electromagnetic Interference Shielding Effectiveness Properties of Ag-Coated Dendritic Cu Fillers Depending on pH of Galvanic Displacement Reaction for Ag Seed Layer and Contents of Deposited Ag Layer

은 코팅 구리 덴드라이트 필러 제조 시 은 시드층 형성을 위한 갈바닉 치환반응 pH 제어 및 은함량에 따른 전자파 차폐 특성

  • Im, Dongha (Korea Institute of Ceramic Engineering and Technology) ;
  • Park, Su-Bin (Korea Institute of Ceramic Engineering and Technology) ;
  • Jung, Hyunsung (Korea Institute of Ceramic Engineering and Technology)
  • 임동하 (한국세라믹기술원 나노융합소재센터) ;
  • 박수빈 (한국세라믹기술원 나노융합소재센터) ;
  • 정현성 (한국세라믹기술원 나노융합소재센터)
  • Received : 2018.08.24
  • Accepted : 2018.10.25
  • Published : 2018.10.31
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Abstract

Ag-coated Cu dendrites were prepared as a filler for an electromagnetic interference shielding application. Ag layers on the Cu dendrites was coated by two approaches. One is a direct autocatalytic plating with a reducing agent. The other approach was achieved by two-step plating, a galvanic displacement reaction to form Ag seed layers on Cu following by an autocatalytic plating with a reducing agent. The procedure-dependent average particle size and tap density of Ag-coated Cu dendrites were characterized. The electrical resistance and electromagnetic interference shielding effect (EMI SE) were analyzed with the Ag-coated Cu dendrites prepared in the two approaches. Additionally, the content of the Ag coated on Cu dendrites was controlled from 2% to 20%. The electrical resistance and EMI SE were critically determined by Ag contents coated on Cu.

Keywords

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Fig. 1. Ag-coated Cu dendritic powder synthesis and paste manufacturing process.

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Fig. 2. Particle size distribution and tap density according to the synthesis process of Ag-coated Cu dendritic powders: (a) direct plating, (b) 2-step plating (pH 4), (c) 2-step plating (pH 1) and (d) comparison of particle size distribution and tap density according to synthesis process.

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Fig. 3. Ag-coated Cu dendritic powders by 2-step electroless plating (pH 1): (a) low magnification SEM image, (b) high magnification SEM image, (c) Cu EDAX mapping, (d) Ag EDAX mapping.

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Fig. 5. EMI SE properties at 1 GHz and resistance according to Ag content of Ag-coated Cu dendritic powders.

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Fig. 4. (a) sample prepared for the evaluation of electromagnetic shielding properties, and (b) EMI SE properties at 1 GHz and resistance of Ag-coated Cu dendritic powders according to synthesis process

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