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http://dx.doi.org/10.5695/JKISE.2018.51.5.263

Electromagnetic Interference Shielding Effectiveness Properties of Ag-Coated Dendritic Cu Fillers Depending on pH of Galvanic Displacement Reaction for Ag Seed Layer and Contents of Deposited Ag Layer  

Im, Dongha (Korea Institute of Ceramic Engineering and Technology)
Park, Su-Bin (Korea Institute of Ceramic Engineering and Technology)
Jung, Hyunsung (Korea Institute of Ceramic Engineering and Technology)
Publication Information
Journal of the Korean institute of surface engineering / v.51, no.5, 2018 , pp. 263-270 More about this Journal
Abstract
Ag-coated Cu dendrites were prepared as a filler for an electromagnetic interference shielding application. Ag layers on the Cu dendrites was coated by two approaches. One is a direct autocatalytic plating with a reducing agent. The other approach was achieved by two-step plating, a galvanic displacement reaction to form Ag seed layers on Cu following by an autocatalytic plating with a reducing agent. The procedure-dependent average particle size and tap density of Ag-coated Cu dendrites were characterized. The electrical resistance and electromagnetic interference shielding effect (EMI SE) were analyzed with the Ag-coated Cu dendrites prepared in the two approaches. Additionally, the content of the Ag coated on Cu dendrites was controlled from 2% to 20%. The electrical resistance and EMI SE were critically determined by Ag contents coated on Cu.
Keywords
Electromagnetic interference shielding; Ag-coated Cu particle; Galvanic displacement;
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1 C. Xu, J. Tamaki, N. Miura and N. Yamazoe, Grain size effects on gas sensitivity of porous SnO2-based elements, Sens. Actuator B-Chem. 3 (1991) 147-155.   DOI
2 S. Geetha, K. Satheesh Kumar, C.R. Rao, M. Vijayan and D. Trivedi, EMI shielding: Methods and materials-A review, J Appl Polym Sci. 112 (2009) 2073-2086.   DOI
3 W. Shen, X. Zhang, Q. Huang, Q. Xu and W. Song, Preparation of solid silver nanoparticles for inkjet printed flexible electronics with high conductivity, Nanoscale. 6 (2014) 1622-1628.   DOI
4 S. Jeong, S.H. Lee, Y. Jo, S.S. Lee, Y.-H. Seo, B.W. Ahn, G. Kim, G.-E. Jang, J.-U. Park and B.-H. Ryu, Air-stable, surface-oxide free Cu nanoparticles for highly conductive Cu ink and their application to printed graphene transistors, J.Mater. Chem. C. 1 (2013) 2704-2710.   DOI
5 W. Li, M. Chen, J. Wei, W. Li and C. You, Synthesis and characterization of air-stable Cu nanoparticles for conductive pattern drawing directly on paper substrates, J. Nanoparticle Res. 15 (2013) 1949.   DOI
6 H. Jiang, K.-S. Moon, J. Lu and C. Wong, Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization, J Electron Mater. 34 (2005) 1432-1439.   DOI
7 A. Muzikansky, P. Nanikashvili, J. Grinblat and D. Zitoun, Ag dewetting in Cu@ Ag monodisperse core-shell nanoparticles, J. Phys. Chem. C. 117 (2013) 3093-3100.
8 M. Grouchko, A. Kamyshny and S. Magdassi, Formation of air-stable copper-silver core-shell nanoparticles for inkjet printing, J. Mater. Chem. 19 (2009) 3057-3062.   DOI
9 M. Tsuji, S. Hikino, Y. Sano and M. Horigome, Preparation of Cu@ Ag core-shell nanoparticles using a two-step polyol process under bubbling of N2 Gas, Chem. Lett. 38 (2009) 518-519.   DOI
10 X. Xu, X. Luo, H. Zhuang, W. Li and B. Zhang, Electroless silver coating on fine copper powder and its effects on oxidation resistance, Mater. Lett. 57 (2003) 3987-3991.   DOI
11 B. Yuan, L. Yu, L. Sheng, K. An and X. Zhao, Comparison of electromagnetic interference shielding properties between single-wall carbon nanotube and graphene sheet/polyaniline composites, J. Phys. D. 45 (2012) 235108.   DOI
12 S. Yang, K. Lozano, A. Lomeli, H.D. Foltz and R. Jones, Electromagnetic interference shielding effectiveness of carbon nanofiber/LCP composites, Compos Part A Appl Sci Manuf. 36 (2005) 691-697.   DOI
13 A. Sawhney, A. Agrawal, P. Patra and P. Calvert, Piezoresistive sensors on textiles by inkjet printing and electroless plating, Mater Res Soc Symp Proc. 920 (2006).
14 H.T. Hai, J.G. Ahn, D.J. Kim, J.R. Lee, Y. Jang, H.S. Chung and C.O. Kim: Advanced Materials Research, 2007, p. 570-574.
15 W. Li, J.A. Virtanen and R.M. Penner, A nanometer-scale galvanic cell, J Phys Chem. 96 (1992) 6529-6532.   DOI
16 C.-Y. Huang and J.-F. Pai, Optimum conditions of electroless nickel plating on carbon fibres for EMI shielding effectiveness of ENCF/ABS composites, Eur. Polym. J. 34 (1998) 261-267.   DOI
17 J.A. Pomposo, J. Rodriguez and H. Grande, Polypyrrole-based conducting hot melt adhesives for EMI shielding applications, Synth Met. 104 (1999) 107-111.   DOI
18 S.-S. Tzeng and F.-Y. Chang, EMI shielding effectiveness of metal-coated carbon fiber-reinforced ABS composites, Mater. Sci. Eng. A. 302 (2001) 258-267.   DOI
19 G.B. Cheng, Solution synthesis of copper microflowers, ELECTRON MATER LETT. 5 (2009) 201-204.   DOI
20 M. Haque and M. Quamruzzaman, Survey on Effect of EMF Emitted by CRT Computer Monitors in Bangladesh, Univers. J. Electr. Electr. Eng. 3 (2015) 149-158.   DOI