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TEM 셀에서 PCB 패턴이 EMI 측정에 미치는 영향 및 PCB 설계 가이드라인 제시

Effects of PCB Patterns on EMI Measurement in TEM Cell and Proposal of PCB Design Guidelines

  • Choi, Minkyoung (School of Electronic Engineering, Soongsil University) ;
  • Shin, Youngsan (School of Electronic Engineering, Soongsil University) ;
  • Lee, Seongsoo (School of Electronic Engineering, Soongsil University)
  • 투고 : 2017.09.18
  • 심사 : 2017.09.28
  • 발행 : 2017.09.30

초록

최근 반도체의 집적도가 증가하고 배선 폭이 미세해짐에 따라 칩 수준의 EMI(electromagnetic interference)가 문제로 대두되고 있다. 이에 따라 칩 제조사는 칩 수준의 EMI를 측정하기 위해 TEM 셀(transverse electromagnetic cell)을 사용하고 있다. 이를 위해 측정용 PCB(printed circuit board)를 제작하여야 하지만, PCB의 배선 패턴 등이 EMI 측정에 영향을 미칠 수 있다는 점이 간과되고 있다. 본 논문에서는 PCB 설계 변수를 변화시켜가며 테스트 패턴을 제작한 다음 TEM 셀의 EMI 측정에 미치는 영향을 분석하였다. 또한 이를 바탕으로 EMI 측정에 미치는 영향을 최소화하기 위한 PCB 설계 가이드라인을 제시하였다.

Recently, semiconductor integration density enormously increases and its interconnection width is significantly narrowed, which leads to EMI (electromagnetic interference) problems on chip level. Chip manufacturer exploits TEM cell (transverse electromagnetic cell) to measure EMI on chip level, which requires PCB (printed circuit board) for measurement purpose. However, it is often neglected to consider that PCB patterns and other factors can affect on EMI measurement. In this paper, several test patterns are designed for different PCB design variables, and effects of PCB patterns on EMI measurement in TEM cell are analyzed. Based on these analyses, PCB design guidelines are also proposed to minimize the effects on EMI measurements.

키워드

참고문헌

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