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Korea Photovoltaic Society (한국태양광발전학회)
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Effect on the Pyramid Structure with Saw Mark Density of Silicon Wafer Surface

실리콘 웨이퍼 표면의 saw mark 밀도에 따른 피라미드 구조의 영향

  • Lee, Min Ji (Department of IT Convergence, Korea National University of Transportation) ;
  • Park, Jeong Eun (Department of Electronic Engineering, Korea National University of Transportation) ;
  • Lee, Young Min (Department of IT Convergence, Korea National University of Transportation) ;
  • Kang, Sang Muk (Department of IT Convergence, Korea National University of Transportation) ;
  • Lim, Donggun (Department of IT Convergence, Korea National University of Transportation)
  • 이민지 (정보기술융합학과 나노전자소자연구실, 한국교통대학교) ;
  • 박정은 (전자공학과 나노전자소자연구실, 한국교통대학교) ;
  • 이영민 (정보기술융합학과 나노전자소자연구실, 한국교통대학교) ;
  • 강상묵 (정보기술융합학과 나노전자소자연구실, 한국교통대학교) ;
  • 임동건 (정보기술융합학과 나노전자소자연구실, 한국교통대학교)
  • Received : 2017.02.18
  • Accepted : 2017.04.03
  • Published : 2017.06.30
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Abstract

Surface texturing is affected the uniformity and size of pyramid with saw mark defect density. To analysis the influence of the saw mark defect density, we textured various si wafer. When the texturing process proceeds without the saw mark removal, silicon wafer of low-saw mark defect density showed small pyramid size of $3.5{\mu}m$ with the lowest average value of the reflectance of 10.6%. When texturing carried out after removal of the saw mark using the TMAH solution, we obtained a reflectance of about 11% and the large pyramid size of $5{\mu}m$. As a result, saw mark wafers showed a better pyramid structure than saw mark-free wafer. This result showed that saw mark can take place more smooth etching by the KOH solution and saw mark-free wafer is determined to be a factor that have a higher reflectance and a large pyramid.

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References

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