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미세피치 패키지 적용을 위한 thin ENEPIG 도금층의 솔더링 특성

Solderability of thin ENEPIG plating Layer for Fine Pitch Package application

  • 백종훈 (한국생산기술연구원 뿌리산업기술연구소 용접접합그룹) ;
  • 이병석 (한국생산기술연구원 뿌리산업기술연구소 용접접합그룹) ;
  • 유세훈 (한국생산기술연구원 뿌리산업기술연구소 용접접합그룹) ;
  • 한덕곤 ((주)엠케이켐앤텍) ;
  • 정승부 (성균관대학교 신소재공학과) ;
  • 윤정원 (한국생산기술연구원 뿌리산업기술연구소 용접접합그룹)
  • Back, Jong-Hoon (Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH)) ;
  • Lee, Byung-Suk (Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH)) ;
  • Yoo, Sehoon (Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH)) ;
  • Han, Deok-Gon (MK Chem & Tech) ;
  • Jung, Seung-Boo (School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
  • Yoon, Jeong-Won (Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH))
  • 투고 : 2017.02.15
  • 심사 : 2017.03.27
  • 발행 : 2017.03.31

초록

본 연구에서는 미세피치 패키지 적용을 위한 기초 실험으로 thin ENEPIG(Electroless Nickel Electroless Palladium Immersion Gold) 도금층을 형성하여 솔더링 특성을 평가하였다. 먼저, Sn-3.0Ag-0.5Cu (SAC305) 솔더합금에 대한 thin ENEPIG 도금층의 젖음 특성이 평가되었으며, 순차적인 솔더와의 반응에 대한 계면반응 및 솔더볼 접합 후 고속 전단 시험을 통한 접합부 기계적 신뢰성이 평가되었다. 젖음성 시험에서 침지 시간이 증가함에 따라 최대 젖음력은 증가하였으며, 5초의 침지 시간 이후에는 최대 젖음력이 일정하게 유지되었다. 초기 계면 반응 동안에는 $(Cu,Ni)_6Sn_5$ 금속간화합물과 P-rich Ni 층이 SAC305/ENEPIG 계면에서 관찰되었다. 연장된 계면반응 후에는 P-rich Ni 층이 파괴 되었으며, 파괴된 P-rich Ni 층 아래에는 $(Cu,Ni)_3Sn$ 금속간화합물이 생성되었다. 고속 전단 시험의 경우, 전단속도가 증가함에 따라 취성 파괴율이 증가하였다.

In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.

키워드

참고문헌

  1. J. W. Yoon, J. W. Kim, J. M. Koo, S. S. Ha, B. I. Noh, W. C. Moon, J. H. Moon, and S. B. Jung, "Flip-chip Technology and Reliability of Electronic Packaging (in Kor.)", Journal of KWS, 25(2), 108 (2007).
  2. K. N. Tu, "Reliability challenges in 3D IC packaging technology", Microelectronics Reliability, 51(3), 517 (2011). https://doi.org/10.1016/j.microrel.2010.09.031
  3. D. H. Park, and T. S. Oh, "Reliability Characteristics of a Package-on-Package with Temperature/Humidity Test, Temperature Cycling Test, and High Temperature Storage Test", J. Microelectron. Packag. Soc., 23(3), 43 (2016). https://doi.org/10.6117/KMEPS.2016.23.3.043
  4. T. Laurila, V. Vuorinen, and J. K. Kivilahti, "Interfacial reactions between lead-free solders and common base materials", Materials Science & Engineering R, 49(1), 1 (2005). https://doi.org/10.1016/j.mser.2005.03.001
  5. M. Abtewa, and G. Selvaduray, "Lead-free Solders in Microelectronics", Materials Science & Engineering R, 27(5), 95 (2000). https://doi.org/10.1016/S0927-796X(00)00010-3
  6. S. J. Lee, and J. P. Jung, "Lead-free Solder Technology and Reliability for Automotive Electronics", J. Microelectron. Packag. Soc., 22(3), 1 (2015). https://doi.org/10.6117/kmeps.2015.22.3.001
  7. J. W. Yoon, J. H. Bang, C. W. Lee, and S. B. Jung, "Interfacial reaction and intermetallic compound formation of Sn-1Ag/ ENIG and Sn-1Ag/ENEPIG solder joints", Journal of Alloys and Compounds, 627, 276 (2015). https://doi.org/10.1016/j.jallcom.2014.11.208
  8. M. L. Huang, and F. Yang, "Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG Joints", Journal of Materials Science & Technology, 31(3), 252 (2015). https://doi.org/10.1016/j.jmst.2015.01.003
  9. J. W. Yoon, B. I. Noh, J. H. Yoon, H. B. Kang, and S. B. Jung, "Sequential interfacial intermetallic compound formation of $Cu_6Sn_5$ and $Ni_3Sn_4$ between Sn-Ag-Cu solder and ENEPIG substrate during a reflow process", Journal of Alloys and Compounds, 509(9), L153 (2011). https://doi.org/10.1016/j.jallcom.2011.01.015
  10. C. Y. Ho, and J. G. Duh, "Optimal Ni(P) thickness design in ultrathin-ENEPIG metallization for soldering application concerning electrical impedance and mechanical bonding strength", Materials Science & Engineering A, 611, 162 (2014). https://doi.org/10.1016/j.msea.2014.05.049
  11. C. Y. Ho, and J. G. Duh, "Quantifying the dependence of Ni(P) thickness in ultrathin-ENEPIG metallization on the growth of Cu-Sn intermetallic compounds in soldering reaction", Materials Chemistry and Physics, 148(1), 21 (2014). https://doi.org/10.1016/j.matchemphys.2014.06.072
  12. H. B. Kang, J. H. Bae, J. W. Lee, M. H. Park, Y. C. Lee, J. W. Yoon, S. B. Jung, and C. W. Yang, "Control of interfacial reaction layers formed in Sn-3.5Ag-0.7Cu/electroless Ni-P solder joints", Scripta Materialia, 60(4), 257 (2009). https://doi.org/10.1016/j.scriptamat.2008.10.017
  13. J. W. Yoon, H. S. Chun, and C. W. Yang, "Investigation of interfacial reaction and joint reliability between eutectic Sn-3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test", J. Mater. Sci: Mater. Electron., 18(5), 559 (2007). https://doi.org/10.1007/s10854-006-9085-4
  14. S. S. Ha, J. K. Jang, S. O. Ha, J. W. Kim, J. W. Yoon, B. W. Kim, S. K. Park, and S. B. Jung, "Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joints Using High- Speed Ball Shear Test", Journal of Electronic Materials, 38(12), 2489 (2009). https://doi.org/10.1007/s11664-009-0916-y
  15. S. M. Lee, J. W. Yoon, and S. B. Jung, "Interfacial reaction and mechanical properties between low melting temperature Sn-58Bi solder and various surface finishes during reflow reactions", J. Mater. Sci: Mater. Electron., 26(3), 1649 (2015). https://doi.org/10.1007/s10854-014-2589-4

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  2. Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints 2018, https://doi.org/10.1007/s10854-017-8426-9
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