마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제24권1호
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  • Pages.83-90
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  • 2017
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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미세피치 패키지 적용을 위한 thin ENEPIG 도금층의 솔더링 특성

Solderability of thin ENEPIG plating Layer for Fine Pitch Package application

  • 백종훈 (한국생산기술연구원 뿌리산업기술연구소 용접접합그룹) ;
  • 이병석 (한국생산기술연구원 뿌리산업기술연구소 용접접합그룹) ;
  • 유세훈 (한국생산기술연구원 뿌리산업기술연구소 용접접합그룹) ;
  • 한덕곤 ((주)엠케이켐앤텍) ;
  • 정승부 (성균관대학교 신소재공학과) ;
  • 윤정원 (한국생산기술연구원 뿌리산업기술연구소 용접접합그룹)
  • Back, Jong-Hoon (Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH)) ;
  • Lee, Byung-Suk (Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH)) ;
  • Yoo, Sehoon (Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH)) ;
  • Han, Deok-Gon (MK Chem & Tech) ;
  • Jung, Seung-Boo (School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
  • Yoon, Jeong-Won (Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH))
  • 투고 : 2017.02.15
  • 심사 : 2017.03.27
  • 발행 : 2017.03.31
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초록

본 연구에서는 미세피치 패키지 적용을 위한 기초 실험으로 thin ENEPIG(Electroless Nickel Electroless Palladium Immersion Gold) 도금층을 형성하여 솔더링 특성을 평가하였다. 먼저, Sn-3.0Ag-0.5Cu (SAC305) 솔더합금에 대한 thin ENEPIG 도금층의 젖음 특성이 평가되었으며, 순차적인 솔더와의 반응에 대한 계면반응 및 솔더볼 접합 후 고속 전단 시험을 통한 접합부 기계적 신뢰성이 평가되었다. 젖음성 시험에서 침지 시간이 증가함에 따라 최대 젖음력은 증가하였으며, 5초의 침지 시간 이후에는 최대 젖음력이 일정하게 유지되었다. 초기 계면 반응 동안에는 $(Cu,Ni)_6Sn_5$ 금속간화합물과 P-rich Ni 층이 SAC305/ENEPIG 계면에서 관찰되었다. 연장된 계면반응 후에는 P-rich Ni 층이 파괴 되었으며, 파괴된 P-rich Ni 층 아래에는 $(Cu,Ni)_3Sn$ 금속간화합물이 생성되었다. 고속 전단 시험의 경우, 전단속도가 증가함에 따라 취성 파괴율이 증가하였다.

In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.

키워드

참고문헌

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피인용 문헌

  1. Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint vol.35, pp.6, 2017, https://doi.org/10.5781/JWJ.2017.35.6.8
  2. Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints 2018, https://doi.org/10.1007/s10854-017-8426-9
  3. Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints vol.36, pp.5, 2017, https://doi.org/10.5781/jwj.2018.36.5.7
  4. OSP 표면처리된 FR-4 PCB기판과 Sn58%Bi 복합솔더 접합부의 미세조직 및 접합강도에 미치는 Sn-MWCNT의 영향 vol.26, pp.4, 2017, https://doi.org/10.6117/kmeps.2019.26.4.163
  5. Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration vol.39, pp.1, 2017, https://doi.org/10.5781/jwj.2021.39.1.11
  6. MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes vol.39, pp.4, 2017, https://doi.org/10.5781/jwj.2021.39.4.2
  7. Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing vol.39, pp.4, 2017, https://doi.org/10.5781/jwj.2021.39.4.4