References
- M. Swaminathan et al., "Power Distribution Networks for System-on-Package: Status and Challenges," IEEE Trans. Adv. Packag., vol. 27, no. 2, May 2004, pp. 286-300. https://doi.org/10.1109/TADVP.2004.831897
- J. Kim et al., "Analysis of Noise Coupling from a Power Distribution Network to Signal Traces in High-Speed Multilayer Printed Circuit Boards," IEEE Trans. Electromagn. Compat., vol. 48, no. 2, May 2006, pp. 319-330. https://doi.org/10.1109/TEMC.2006.873865
- T.-L. Wu et al., "Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology," IEICE Trans. Commun., vol. E93.B, no. 7, July 2010, pp. 1678-1689. https://doi.org/10.1587/transcom.E93.B.1678
- T.-L. Wu, H.-H. Chuang, and T.-K. Wang, "Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation," IEEE Trans. Electromagn. Compat., vol. 52, no. 2, May 2010, pp. 346-356. https://doi.org/10.1109/TEMC.2009.2039575
- E.-P. Li et al., "Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects," IEEE Trans. Electromagn. Compat., vol. 52, no. 2, May 2010, pp. 248-265. https://doi.org/10.1109/TEMC.2010.2048755
- R. Abhari and G.V. Eleftheriades, "Metallo-Dielectric Electromagnetic Bandgap Structures for Suppression and Isolation of the Parallel-Plate Noise in High-Speed Circuits," IEEE Trans. Microw. Theory Techn., vol. 51, no. 6, June 2003, pp. 1629-1639. https://doi.org/10.1109/TMTT.2003.812555
- S. Shahparnia and O.M. Ramahi, "Miniaturized Electromagnetic Bandgap Structures for Broadband Switching Noise Suppression in PCBs," Electron. Lett., vol. 41, no. 9, Apr. 2005, pp. 519-520. https://doi.org/10.1049/el:20050445
- M. Kwon, M. Kim, and D.G. Kam, "Optimization of a Defected Ground Structure to Improve Electromagnetic Bandgap Performance," J. Electromagn. Eng. Sci., vol. 14, no. 4, Dec. 2014, pp. 346-348. https://doi.org/10.5515/JKIEES.2014.14.4.346
- J. Choi et al., "Noise Isolation Inmixed-Signal Systems Using Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure-Based Power Distribution Network (PDN)," IEEE Trans. Adv. Packag., vol. 33, no. 1, Feb. 2010, pp. 2-12. https://doi.org/10.1109/TADVP.2009.2033705
- Y. Toyota et al., "Stopband Analysis Using Dispersion Diagram for Two-Dimensional Electromagnetic Bandgap Structures in Printed Circuit Boards," IEEE Microw. Wireless Compon. Lett., vol. 16, no. 12, Dec. 2006, pp. 645-647. https://doi.org/10.1109/LMWC.2006.885587
- T.-L. Wu, Y.-H. Lin, and S.-T. Chen, "A Novel Power Planes with Low Radiation and Broadband Suppression of Ground Bounce Noise Using Photonic Bandgap Structures," IEEE Microw. Wireless Comp. Lett., vol. 14, no. 7, July 2004, pp. 337-339. https://doi.org/10.1109/LMWC.2004.829275
- M. Kim et al., "Application of VSI-EBG Structure to High-Speed Differential Signals for Wideband Suppression of Common-Mode Noise," ETRI J., vol. 35, no. 5, Oct. 2013, pp. 827-837. https://doi.org/10.4218/etrij.13.0112.0875
- M. Kim et al., "Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs," IEEE Trans. Electromagn. Compat., vol. 55, no. 2, Apr. 2013, pp. 307-314. https://doi.org/10.1109/TEMC.2012.2216883
- H.-R. Zhu and J.-F. Mao, "Localized Planar EBG Structure of CSRR for Ultrawideband SSN Mitigation and Signal Integrity Improvement in Mixed-Signal Systems," IEEE Trans. Compon., Packag., Manuf. Technol., vol. 3, no. 12, 2013, pp. 2092-2100. https://doi.org/10.1109/TCPMT.2013.2272788
- J.H. Kwon et al., "Novel Electromagnetic Bandgap Array Structure on Power Distribution Network for Suppressing Simultaneous Switching Noise and Minimizing Effects on High Speed Signals," IEEE Trans. Electromagn. Compat., vol. 52, no. 2, May 2010, pp. 365-372. https://doi.org/10.1109/TEMC.2010.2045894
- J.H. Kwon and J.G. Yook, "Partial Placement of EBG on Both Power and Ground Planes for Broadband Suppression of Simultaneous Switching Noise," IEICE Trans. Commun., vol. E92.B, no. 7, July 2009, pp. 2550-2553. https://doi.org/10.1587/transcom.E92.B.2550
- J.H. Kwon et al., "Partial Placement of Electromagnetic Bandgap Unit Cells to Effectively Mitigate Simultaneous Switching Noise," Electron. Lett., vol. 44, no. 22, Oct. 2008, pp. 1302-1303. https://doi.org/10.1049/el:20082079
- C.-L. Wang et al., "A Systematic Design to Suppress Wideband Ground Bounce Noise in High-Speed Circuits by Electromagnetic-Bandgap-Enhanced Split Powers," IEEE Trans. Microw. Theory Techn., vol. 54, no. 12, 2006, pp. 4209-4217. https://doi.org/10.1109/TMTT.2006.886387
- R.E. Collin, Field Theory of Guided Waves, New York, USA: IEEE Press, 1991.
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