한국기계가공학회지 (Journal of the Korean Society of Manufacturing Process Engineers)

  • 제15권3호
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  • Pages.66-71
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  • 2016
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  • 1598-6721(pISSN)
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  • 2288-0771(eISSN)
한국기계가공학회 (The Korean Society of Manufacturing Process Engineers)
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태양전지용 실리콘 웨이퍼의 멀티 와이어 쏘잉 시 절삭저항력에 관한 연구

A Study on Cutting Force during Multi Wire Sawing of Silicon Wafers for Solar Cells

  • Hwang, In-Hwan (Department of Engineering Science & Mechanics, Kumoh National Institute of Technology) ;
  • Park, Sang-Hyun (Department of Engineering Science & Mechanics, Kumoh National Institute of Technology) ;
  • An, Kuk-Jin (SAEHAN NANOTECH LTD.) ;
  • Kwun, Geon-Dae (SAEHAN NANOTECH LTD.) ;
  • Lee, Chan-Jong (Department of Engineering Science & Mechanics, Kumoh National Institute of Technology)
  • 투고 : 2015.12.21
  • 심사 : 2016.04.04
  • 발행 : 2016.06.30
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초록

Reducing the wafer breakage rate and sawing thinner wafers will decrease the cost of solar cells. This study was carried out in order to identify ways to achieve this goal. In this study, the cutting force characteristics using an ingot tilting-type diamond multi wire-sawing machine were analyzed. The cutting force was analyzed while varying the tilting angles and wire speed. The obtained data were analyzed by classifying the tangential cutting force and the normal cutting force. In this cutting force experiment, the difference between the forces was confirmed; it was found that it rises with increasing the tilting angles and decreases when the wire speed elevates. The resulting value can be utilized as basic data for the determination of an ideal cutting recipe.

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참고문헌

  1. Yang, F., and Kao, I., "Interior Stress for Axisymmetric Abrasive Indentation in the Free Abrasive Machining Process: Slicing Silicon Wafers With Modern Wiresaw," Journal of Electronic Packaging, Vol. 121, No. 3, pp. 191-195, 1999. https://doi.org/10.1115/1.2792683
  2. Liedke, T. and Kuna, M., "A Macroscopic Mechanical Model of the Wire Sawing Process," International Journal of Machine Tools & Manufacture, Vol. 51, pp. 711-720, 2011. https://doi.org/10.1016/j.ijmachtools.2011.05.005
  3. Kao, I., "Technology and Research of Slurry Wiresaw Manufacturing Systems in Wafer Slicing with Free Abrasive Machining," International Journal of Advanced Manufacturing Systems, Vol. 7, pp. 7-20, 2004.
  4. Zhu, L. and Kao, I., "Galerkin-based Modal Analysis on the Vibration of Wire-slurry System in Wafer Slicing using a Wiresaw," Journal of Sound and Vibration, Vol. 283, pp. 589-620, 2005. https://doi.org/10.1016/j.jsv.2004.04.018
  5. Chen, W., Lin, X., Li, M., Yin, C. and Zhou, L., "On the Nature and Removal of Saw Marks on Diamond Wire Sawn Multicrystalline Silicon Wafers," Materials Science in Semiconductor Processing , Vol. 27, pp. 220-227, 2014. https://doi.org/10.1016/j.mssp.2014.06.049
  6. Wu, h., "Wire Sawing Technology: A State-of-the-art Review," Precision Engineering, Vol. 43, pp. 1-9, 2016. https://doi.org/10.1016/j.precisioneng.2015.08.008
  7. Park, C. Y., Kweon, H. K.. Peng, B. and Jung, B. G., "A Study on New Twist-Diamond Wire Characteristics for Improving Processing Performance," Journal of the Korean Society of Manufacturing Process Engineers, Vol. 15, No. 1, pp. 26-33, 2016. https://doi.org/10.14775/ksmpe.2016.15.1.026

피인용 문헌

  1. Development of Optical Leveling System using Quarter Photodetector vol.17, pp.6, 2018, https://doi.org/10.14775/ksmpe.2018.17.6.111