반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

CMP 후 세정용 PVA 브러쉬의 접촉압력 분포 측정

Contact Pressure Distribution Measurement of PVA Brush for Post CMP Cleaning

  • 투고 : 2016.12.13
  • 심사 : 2016.12.26
  • 발행 : 2016.12.31
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초록

Contact pressure distribution between PVA brush and semiconductor wafer was measured by developing a test setup which could simulates the post CMP cleaning process. The test set-up used thin film type pressure sensor which could measure the pressure distribution of contact area with the resolution of $15.5ea/cm^2$. As the experimental results, it was verified that there had been severe contact pressure non-uniformity along the axis of the brush and between the adjacent projections on the brush's surface. These results should be considered when developing post CMP cleaning stage or designing the PVA brush.

키워드

참고문헌

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