Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
권호 표지

Contact Pressure Distribution Measurement of PVA Brush for Post CMP Cleaning

CMP 후 세정용 PVA 브러쉬의 접촉압력 분포 측정

  • Received : 2016.12.13
  • Accepted : 2016.12.26
  • Published : 2016.12.31
Download PDF
⟨ Previous Next ⟩

Abstract

Contact pressure distribution between PVA brush and semiconductor wafer was measured by developing a test setup which could simulates the post CMP cleaning process. The test set-up used thin film type pressure sensor which could measure the pressure distribution of contact area with the resolution of $15.5ea/cm^2$. As the experimental results, it was verified that there had been severe contact pressure non-uniformity along the axis of the brush and between the adjacent projections on the brush's surface. These results should be considered when developing post CMP cleaning stage or designing the PVA brush.

Keywords

References

  1. S. H. Kim, T. Katoh, H. G. Kang, M. S. Kim, U. G. Paik, J. G. Park, "Effect of the Nano Ceria Slurry Characteristics on end Point Detection Technology for STI CMP", J. the Semiconductor & Display Equipment Technology, Vol. 3, No. 1, pp. 15-20, 2004.
  2. M. Y. Lee, T. Katoh, H. G. Kang, J. H. Park, J. G. Park, U. Paik, "Effect of Large Particles and Filter Size in Central Chemical Supplying(CCS) System for STI-CMP on Light Point Defects(LPDs)", J. the Semiconductor & Display Equipment Technology, Vol. 3, No. 4, pp. 139-144, 2004.
  3. O. K. Kwon, T. H. Choi, J. H. Lee, "Molecular Dynamics Study on Property Change of CMP Process by Pad Hardness", J. the Semiconductor & Display Technology, Vol. 12, No. 1, pp. 61-65, 2013.
  4. S. Y. Lee, K. S. Kim, "A Numerical Analysis Using CFD for Effective Process at CMP Equipment", J. the Semiconductor & Display Technology, Vol. 10, No. 4, pp. 61-65, 2011.
  5. Hong Jin Kim, "Effect of Brush Treatment and Brush Contact Sequence on Cross Contaminated Defects during CMP in-situ Cleaning", J. Korean Soc. Tribol. Lubr. Eng., Vol. 31, No. 6, pp. 239-244, December 2015. https://doi.org/10.9725/kstle.2015.31.6.239
  6. Hanchul Cho, Youngmin Kim, Hyunseop Lee, Sukbae Joo, Haedo Jeong, "The Effect of PVA Brush Scrubbing on Post CMP Cleaning Process for Damascene Cu Interconnection", Solid State Phenomena Vols. 145-146, pp. 367-370, 2009. https://doi.org/10.4028/www.scientific.net/SSP.145-146.367
  7. Woon-Ki Shin, Sun-Joon Park, Hyun-Seop Lee, Moon-Ki Jeong, Young-Kyun Lee, Ho-Jun Lee, Young-Min Kim, Han-Chul Cho, Suk-Bae Joo and Hae-Do Jeong, "Particle Removal on Buffing Process After Copper CMP", J. KIEEME, Vol. 24, No. 1, pp. 17-21, January 2011.
  8. J. H. An, Y. B. Park, H. D. Jeong, "Structural Effect of PVA Brush Nodule on Particle Removal Efficiency during Brush Scrubber Cleaning", Key Engineering Materials, Vol. 516, pp. 84-89, 2012. https://doi.org/10.4028/www.scientific.net/KEM.516.84
  9. Pressure Mapping Sensor 5101, Tekscan Data Sheet.