라인형 플라즈마 소스를 이용한 ALD 공정 연구

Study of ALD Process using the Line Type Plasma Source

  • 투고 : 2016.11.08
  • 심사 : 2016.12.26
  • 발행 : 2016.12.31

초록

In this study, a new plasma source was used in the ALD process. Line type plasma sources were analyzed by electric and magnetic field simulation. And the results were compared with plasma density and electron temperature measurement results. As a result, the results of the computer simulation and the diagnosis results of plasma density and electron temperature showed similar tendency. At this time, the plasma uniformity is 95.6 %. $Al_2O_3$ thin film was coated on 6 inch Si-wafer, using this plasma source. The uniformity of the thin film was more than 98% and the thin film growth rate was 0.13 nm/cycle.

키워드

참고문헌

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