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Characteristics of Carbon Tetrafluoride Plasma Resistance of Various Glasses

  • Choi, Jae Ho (Engineering Ceramic Center, Korea Institute of Ceramic Engineering and Technology) ;
  • Han, Yoon Soo (Engineering Ceramic Center, Korea Institute of Ceramic Engineering and Technology) ;
  • Lee, Sung Min (Engineering Ceramic Center, Korea Institute of Ceramic Engineering and Technology) ;
  • Park, Hyung Bin (Engineering Ceramic Center, Korea Institute of Ceramic Engineering and Technology) ;
  • Choi, Sung Churl (Department of Materials Science and Engineering, Hanyang University) ;
  • Kim, Hyeong Jun (Engineering Ceramic Center, Korea Institute of Ceramic Engineering and Technology)
  • 투고 : 2016.09.30
  • 심사 : 2016.11.22
  • 발행 : 2016.11.30

초록

Etch rate, surface roughness and microstructure as plasma resistance were evaluated for six kinds of oxide glass with different compositions. Borosilicate glass (BS) was found to be etched at the highest etch rate and zinc aluminum phosphate glass (ZAP) showed a relatively lower etch rate than borosilicate. On the other hand, the etching rate of calcium aluminosilicate glass (CAS) was measured to be similar to that of sintered alumina while yttrium aluminosilicate glass (YAS) showed the lowest etch rate. Such different etch rates by mixture plasma as a function of glass compositions was dependent on whether or not fluoride compounds were formed on glass and sublimated in high vacuum. Especially, in view that $CaF_2$ and $YF_3$ with high sublimation points were formed on the surface of CAS and YAS glasses, both CAS and YAS glasses were considered to be a good candidate for protective coating materials on the damaged polycrystalline ceramics parts in semi-conductor and display processes.

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참고문헌

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피인용 문헌

  1. Effect of CaF2 on fluorocarbon plasma resistance and thermal properties of CaO-Al2O3-SiO2 glasses vol.9, pp.1, 2016, https://doi.org/10.1080/21870764.2020.1868079