마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제22권3호
  • /
  • Pages.51-56
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  • 2015
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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전해Ni, 무전해 Ni pad에서의 Cu 함량에 따른 접합 신뢰성에 관한 연구

A Study of Joint Reliability According to Various Cu Contents between Electrolytic Ni and Electroless Ni Pad Finish

  • 이현규 (덕산하이메탈(주) R&D 센터) ;
  • 천명호 (덕산하이메탈(주) R&D 센터) ;
  • 추용철 (덕산하이메탈(주) R&D 센터) ;
  • 오금술 (덕산하이메탈(주) R&D 센터)
  • 투고 : 2015.08.24
  • 심사 : 2015.09.25
  • 발행 : 2015.09.30
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초록

솔더 조인트의 신뢰성 강화를 위해서 다양한 pad finish material이 사용되고 있으며, 최근에는 Electroless Ni Electroless Pd Immersion Gold (이하 ENEPIG) pad가 많이 사용되고 있다. 따라서, 본 연구는 상용화 되어 사용중인 Electrolytic Ni (soft Ni) pad와 최근 이슈가 되고 있는 ENEPIG pad에 대한 신뢰성 평가에 관한 것으로, 다양한 Cu 함량에 따른 거동을 관찰 하였다. Reflow 후 솔더와 pad간의 접합층은 $Cu_6Sn_5$에 Ni이 치환된 형태의 금속간 화합물로 구성되어 있었으며, ENEPIG pad의 경우, 접합층과 Ni layer 사이에 $Ni_3P$ (dark layer) layer가 관찰 되었다. 또한, Cu 함량에 따라 Dark layer의 두께를 제어할 수 있었다. 충격 낙하 시험 후, 파괴모드를 관찰한 결과 soft Ni pad와 ENEPIG pad에서 서로 다른 파괴모드가 관찰 되었으며, soft Ni의 경우, 1차 IMC와 2차 IMC 경계에서 파괴가 관찰 되었고, ENEPIG pad의 경우, dark layer에서 파괴가 관찰 되었다. IMC와 pad material, bulk 솔더와의 lattice mismatch에 의해 불안정한 계면이 존재하며, 이는 연속적인 외부 충격에 의해 가해진 열적, 물리적 스트레스를 IMC 계면으로 전송하기 때문에, 솔더의 신뢰성 향상을 위해서는 솔더 벌크의 제어와 IMC의 두께 및 형상의 제어는 필요하다.

It has been used various pad finish materials to enhance the reliability of solder joint and recently Electroless Ni Electroless Pd Immersion Gold (the following : ENEPIG) pad has been used more than others. This study is about reliability according to being used in commercial Electrolytic Ni pad and ENEPIG pad, and was observed behavior of various Cu contents. After reflow, the inter-metallic compound (IMC) between solder and pad is composed of $Cu_6Sn_5$ (Ni substituted) by using EDS, and in case of ENEPIG, between IMC and Ni layer was observed the dark layer ($Ni_3P$ layer). Additional, it could be controlled the thickness of dark layer according to Cu contents. Investigated the different fracture mode between electrolytic Ni and ENEPIG pad after drop shock test, in case of soft Ni, accelerated stress propagated along the interface between $1^{st}$ IMC and $2^{nd}$ IMC, and in case of ENEPIG pad, accelerated stress propagated along the weaken surface such as dark layer. The unstable interface exists through IMC, pad material and solder bulk by the lattice mismatch, so that the thermal and physical stress due to the continuous exterior impact is transferred to the IMC interface. Therefore, it is strongly requested to control solder morphology, IMC shape and thickness to improve the solder reliability.

키워드

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