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사출금형의 열팽창을 고려한 변형 분석

Deformation Analysis Considering Thermal Expansion of Injection Mold

  • 투고 : 2015.04.15
  • 심사 : 2015.07.01
  • 발행 : 2015.09.01

초록

사출 금형 설계에서 금형 온도 분포와 변형은 사출품의 플래시나 표면 단차에 주요한 영향 인자이다. 금형 온도 분포와 성형면의 압력분포를 예측하기 위하여 먼저 금형을 포함한 사출해석을 수행하였다. 계산된 온도분포와 압력분포는 금형 구조해석의 입력조건으로 사용하였다. 해석의 정확성을 위하여 금형 전체 세트에 대한 구조해석 조건을 도출하였다. 도출된 해석 모델로 성형면의 단차 및 벌어짐 크기에 대하여 금형 열팽창, 성형 중 온도변화의 영향을 분석하였다. 해석 결과를 바탕으로 성형면의 단차 감소 방안을 도출하였다.

In the design of injection molds, the temperature distribution and deformation of the mold is one of the most important parameters that affect the flow characteristics, flash generation, and surface appearance, etc. Plastic injection analyses have been carried out to predict the temperature distribution of the mold and the pressure distribution on the cavity surface. As the input loads, we transfer the temperature and pressure results to the structural analysis. We compare the structural analysis results with the thermal expansion effect using the actual flash and step size of a smartphone cover part. To reduce the flash problem, we proposed a new mold design, and verified the results by performing simulations.

키워드

참고문헌

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