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터치패널과 LCD 모듈 접착면 분리용 장비 개발

Development of Device for the Separation between Touch Panel and LCD Module

  • 왕문평 (금오공과대학교 기계시스템공학과 대학원) ;
  • 박경석 (금오공과대학교 기계시스템공학과) ;
  • 신동원 (금오공과대학교 기계시스템공학과)
  • Wang, Wenping (Graduate School, Kumoh National Univ.) ;
  • Park, Kyoungseok (Department of Mechanical System Engineering, Kumoh National Univ.) ;
  • Shin, Dongwon (Department of Mechanical System Engineering, Kumoh National Univ.)
  • 투고 : 2014.08.07
  • 심사 : 2015.04.02
  • 발행 : 2015.04.30

초록

Recently, mobile phones have become necessary tools for everyday life. In this study, a device that can serve as a separation between a touch panel and an LCD module in a mobile phone was devised for mass repair processes at a smaill business. We used a wire cutting method to separate the bonding plate area between the modules. The device is composed of DC motors and stepping motors that can deliver a precise cutting motion. The motor control system is connected by individual control modules to a CAN network. The developed device showed excellent performance at high temperature conditions.

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참고문헌

  1. Su-uk, Ryu., Kyoungseok, Park, "A Study of Bridge Connector Development on Wiring Harness Improvement in Vehicles", J. of KSMPE, Vol.9-2, pp. 66-72, 2010.
  2. Su-uk, Ryu., Kyoungseok, Park, "A Development of Control System for Agicultural Machinery by using Distributed Control", J. of KSMPE, Vol.10-6, pp. 39-45, 2010.
  3. Seunghoon Kim, Wootaik Lee, Myoungho Sunwoo, "A Co-simulation Toolbox for Distributed Real-Time Control System", KSAE vol.11. No.1, 2003
  4. Kyoungseok Park, M.P. Wang, G.H. Kwon, "A wire cutting machine for the separation of TSP/LCD modules in cellular phones", KSMTE, Vib. and Control Division Conference 2013, pp 37-37.