마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제22권1호
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  • Pages.51-54
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  • 2015
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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Development of Copper Electro-Plating Technology on a Screen-Printed Conductive Pattern with Copper Paste

  • Eom, Yong-Sung (Energy Harvesting Device Research Sectiion, Electronics and Telecommunications research Institute) ;
  • Son, Ji-Hye (Energy Harvesting Device Research Sectiion, Electronics and Telecommunications research Institute) ;
  • Lee, Hak-Sun (Energy Harvesting Device Research Sectiion, Electronics and Telecommunications research Institute) ;
  • Choi, Kwang-Seong (Energy Harvesting Device Research Sectiion, Electronics and Telecommunications research Institute) ;
  • Bae, Hyun-Cheol (Energy Harvesting Device Research Sectiion, Electronics and Telecommunications research Institute) ;
  • Choi, Jeong-Yeol (Department of Materials Science and Engineering, Hongik University) ;
  • Oh, Tae-Sung (Department of Materials Science and Engineering, Hongik University) ;
  • Moon, Jong-Tae (CEO of Hojeonable Ltd.)
  • 투고 : 2015.03.14
  • 심사 : 2015.03.27
  • 발행 : 2015.03.30
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초록

An electro-plating technology on a cured isotropic conductive pattern with a hybrid Cu paste composed of resin matrix, copper, and solder powders has been developed. In a conventional technology, Ag paste was used to perform a conductive pattern on a PCB or silicon substrate. From previous research, the electrical conductive mechanism and principle of the hybrid Cu paste were concisely investigated. The isotropic conductive pattern on the PCB substrate was performed using screen-printing technology. The optimum electro-plating condition was experimentally determined by processing parameters such as the metal content of the hybrid Cu paste, applied current density, and time for the electroplating in the plating bath. The surfaces and cross-sections were observed using optical and SEM photographs. In conclusion, the optimized processing conditions for Cu electro-plating technology on the conductive pattern were a current density of $40mA/cm^2$ and a plating time of 20min on the hybrid Cu paste with a metal content of 44 vol.%. More details of the mechanical properties and processing conditions will be investigated in further research.

키워드

참고문헌

  1. A. Mette, "New Concepts for Front Side Metallization of Industrial Silicon Solar Cells", Ph.D Thesis, Fraunhofer-Institute for Solar Energy System, Freiburg im Breisgau, Germany (2007).
  2. A. Nguyen, A. Fioramonti, D. Morrissey, H. Efstathiadis, Z. Zhouying and P. Haldar, "Feasibility of Improving Front Metallization Lines for Photovoltaic Devices", Proc. 34th Photovoltaic Specialists Conference (PVSC), Philadelphia, PA, 000312, IEEE (2009).
  3. Y. S. Eom, J. W. Baek, J. T. Moon, J. D. Nam and J. M. Kim, "Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film", Microelectron. Eng., 85(2), 327 (2008). https://doi.org/10.1016/j.mee.2007.07.005
  4. Y. S. Eom, K. S. Jang, J. T. Moon, J. D. Nam and J. M. Kim, "Electrical and Mechanical Characterization of an Anisotropic Conductive Adhesive with a Low Melting Point Solder", Microelectron. Eng., 85(11), 2202 (2008). https://doi.org/10.1016/j.mee.2008.05.038
  5. Y. S. Eom, K. S. Jang, J. T. Moon and J. D. Nam, "Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder", ETRI J., 32(3), 414 (2010). https://doi.org/10.4218/etrij.10.0109.0400
  6. J. W. Baek, K. S. Jang, Y. S. Eom, J. T. Moon, J. M. Kim and J. D. Nam, "Chemo-rheological Characteristic of a Selfassembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder", Microelectron. Eng., 87(10), 1968 (2010). https://doi.org/10.1016/j.mee.2009.12.020
  7. K. S. Jang, Y. S. Eom, J. T. Moon, Y. S. Oh and J. D. Nam, "Catalytic Behavior of Sn/Bi Metal Powder in Anhydride-Based Epoxy Curing", J. Nanosci. Nanotechnol., 9(12), 7461 (2009).
  8. K. S. Choi, K. J. Sung, B. O. Lim, H. C. Bae, S. H. Jung, J. T. Moon and Y. S. Eom, "Novel Maskless Bumping for 3D integration", ETRI J., 32(2), 342 (2010). https://doi.org/10.4218/etrij.10.0209.0396
  9. Y. S. Eom, K. S. Choi, S. H. Moon, J. H. Park, J. H. Lee and J. T. Moon, "Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive", ETRI J., 33(6), 864 (2011). https://doi.org/10.4218/etrij.11.0110.0520
  10. G. H. Kim, K. M. Jung, J. T. Moon and J. H. Lee, "Electrical Resistivity and Thermal Conductivity of Paste Containing Ag-coated Cu Flake Filler", J. Microelectron. Packag. Soc., 21(4), 51 (2014). https://doi.org/10.6117/kmeps.2014.21.4.051

피인용 문헌

  1. Fabrication of Cu–MWNT nanocomposite and its electrochemical migration behaviors vol.27, pp.9, 2016, https://doi.org/10.1007/s10854-016-5028-x