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A Prediction of Wafer Yield Using Product Fabrication Virtual Metrology Process Parameters in Semiconductor Manufacturing

반도체 제조 가상계측 공정변수를 이용한 웨이퍼 수율 예측

  • Nam, Wan Sik (Department of Industrial Management Engineering, Korea University) ;
  • Kim, Seoung Bum (Department of Industrial Management Engineering, Korea University)
  • 남완식 (고려대학교 산업경영공학과) ;
  • 김성범 (고려대학교 산업경영공학과)
  • Received : 2015.02.09
  • Accepted : 2015.06.16
  • Published : 2015.12.15

Abstract

Yield prediction is one of the most important issues in semiconductor manufacturing. Especially, for a fast-changing environment of the semiconductor industry, accurate and reliable prediction techniques are required. In this study, we propose a prediction model to predict wafer yield based on virtual metrology process parameters in semiconductor manufacturing. The proposed prediction model addresses imbalance problems frequently encountered in semiconductor processes so as to construct reliable prediction model. The effectiveness and applicability of the proposed procedure was demonstrated through a real data from a leading semiconductor industry in South Korea.

Keywords

References

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