The Journal of the Korea institute of electronic communication sciences (한국전자통신학회논문지)

Korea Institute of Electronic Communication Science (한국전자통신학회)
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Analysis of Signal Distortion for Ultra High Definition Video Pattern Control

UHD급 영상패턴 제어를 위한 전송선로의 신호 왜곡현상 분석

  • 손희배 (경남대학교 정보통신공학과) ;
  • 진종호 (경남대학교 정보통신공학과) ;
  • 이영철 (경남대학교 정보통신공학과)
  • Received : 2014.08.05
  • Accepted : 2014.10.17
  • Published : 2014.10.31
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Abstract

Recently signal transmission of ultra high-definition(4K-UHD) video system is transferred as uncompressed high speed data. However, this has a limit to compose the system because EMI between separate cables of high speed interface section and skew bring distortion of the video signal and jitter. In this paper we applied V-by-One HS interface technique to transfer uncompressed high speed data. We analyzed HSD(High Speed Differential) transmission line signal integrity. Also we applied RF transmission technique instead of UHD video pattern control interface PCB design. When we measured V-by-One HS video signal of designed 4K-UHD class signal generator, We found that the transmission performance has been signal standard.

최근 초고화질(4K-UHD) 영상 시스템의 신호전송은 비압축 고속 데이터로 전송되며 고속 신호의 인터페이스 구간에 서로 다른 케이블 사이에서 나타나는 EMI, 스큐(skew) 문제로 인하여 영상신호의 왜곡, 지터 등으로 시스템 구현에 한계가 있다. 이와 같이 비압축 고속 데이터를 고속전송하기 위하여 V-by-One HS 인터페이스 기법을 적용하여 본 논문에서는 고속 영상신호에 대하여 HSD(High Speed Differential) 전송선로의 신호무결성을 분석하였다. UHD 영상패턴 제어 인터페이스의 PCB 설계 방법을 RF 전송기법으로 적용하였으며 구현된 4K-UHD급 영상패턴 제어 신호발생기의 V-by-One HS 영상신호를 측정한 결과, 전송품질이 고속전송신호규격에 만족함을 보였다.

Keywords

References

  1. K. Kaneko and N. Ohta, "4K applications beyond digital cinema," 2010 16th Int. Conf. on VSMM, Seoul, Korea, Oct. 2010, pp. 133-136.
  2. H. Takizuka, T. Torikai, A. Mitsui, H. Suzuki, and Y. Watanabe, "A proposal of novel optical interface to transmit 8K-UHDTV for consumer application," 2013 18th Microoptics Conf. (MOC), Tokyo, Oct. 2013, pp. 1-2.
  3. S.-L. Chung and W.-Y. Chen, "Design of Test Pattern Databank for Functional Testing of LCD Panels," 2006 IEEE Int. Symp. on Industrial Electronics, Montreal, Canada, July 2006, pp. 3002-3007.
  4. W. Park and S.-C. Lee, "Design of LVDS driver based CMOS transmitter for a high speed serial link," 2010 Int. Conf. on ICEIE, Kyoto, Japan, Aug. 2010.
  5. K. Cho, S.-J. Lee, S.-M. Kim, and D.-H. Kim, "Display signal interface techniques for mobile applications," 2011 3rd Asia Symp. on Quality Electronic Design, Kuala Lumpur, Malaysia, July 2011, pp. 105-108.
  6. H.-K. Jeon, H.-R. Kim, J.-M. Choi, J.-P. Hong, Y.-S. Kim, H.-S. Oh, D.-K. Han, and L.-S. Kim, "High speed serial interface for mobile LCD driver IC," 2008 ISCAS Circuits and Systems, Seattle, WA, May 2008, pp. 157-160.
  7. F. Ran and L. Z. Wang, "FPGA Implementation for Image Processing Module in TCON," Image and Signal Processing, 2009 CISP'09. 2nd Int. Congress on. IEEE, Tianjin, China, Oct. 2009, pp. 1-4.
  8. A. Brandl, E. Recht, and V. Bar-Natan, "LVDS signal integrity for video transmission lines," 2003 IEEE Int. Symp. on Electromagnetic Compatibility, Istanbul, Turkey, vol. 1, May 2003, pp. 537-538.
  9. D. Johnson, "An FPGA-based solution for testing legacy video displays," 2010 IEEE AUTOTESTCON, Orlando, FL, Sept. 2010.
  10. D. Xiaomin, R. Rimolo-Donadio, H. Bruns, and C. Schuster, "Fast and concurrent simulations for SI, PI, and EMI analysis of multilayer printed circuit boards," 2010 AMEMC, Beijing, China, Apr. 2010, pp. 614-617.
  11. X. Ying and Y. Zhaowen, "EMI and PI analysis of analog board," 2013 IEEE 5th Int. Symp. MAPE, Chengdu, China, Oct. 2013, pp. 171-175.
  12. L.-X. Wang, Y.-X. Zhang, and G. Zhang, "Power Integrity Analysis for High-Speed PCB," 2010 First Int. Conf. on PCSPA, Harbin, China, Sept. 2010, pp. 414-418.
  13. E. T. M. Shang, S.-C. Lee, and P. Sebastian, "Signal Integrity Analysis for High Speed Digital Circuit," 2010 Int. Conf. on ICIAS, Kuala Lumpur, Malaysia, June 2010.
  14. Y.-F. Han and Z. Yan, "The Simulation and Pre-design on the PCB of the Simulator," 2008 APMC Electromagnetic Compatibility and 19th Int. Zurich Symp. on Electromagnetic, Singapore, May 2008, pp. 871-874.
  15. A. Lingambudi, G. Edlund, A. Haridass, and D. Becker, "A case study of high-speed serial interface simulation with IBIS-AMI models," 2012 IEEE Electrical Design of Advanced Packaging and System Symp., Taipei, Taiwan, Dec. 2012, pp. 145-148.
  16. L. Fu, Y. Han, and K. Wu, " Signal integrity research for high-speed vedio system design based on HyperLynx simulation," 2011 3rd ICCRD, Shanghai, China, Mar. 2011, pp. 15-18.
  17. Y.-G. Jang and Y.-C. Rhee, "A Study on the Signal Integrity and Distorted Signal Analysis of High Speed Transmission," J. of the Korea Institute of Electronic Communication Sciences, vol. 7, no. 2, 2012, pp. 213-219.
  18. H. J. Visser, "Equivalent length design equations for right-angled microstrip bends," 2007 The Second European Conf. on Antennas and Propagation, Edinburgh, United Kingdom, Nov. 2007.
  19. A. Weisshaar, S. Luo, M. Thorburn, V. K. Tripathi, M. Goldfarb, J.-L. Lee, and E. Reese, "Modeling of radial microstrip bends," 1990 IEEE MTT-S Int. Microwave Symp. Digest, vol. 3, Dallas, TX, May 1990, pp. 1051-1054.
  20. K.-J. Kim and H.-S. Ko, "The Optimization using PCB EM interpertation of GEO satellite's L Band Converter," J. of the Korea Institute of Electronic Communication Sciences, vol. 8, no. 8, 2013, pp. 1219-1226. https://doi.org/10.13067/JKIECS.2013.8.8.1219
  21. K.-H. Chung, Y.-J. Jang, C.-W. Jung, and S.-K. Kim, "A study on Source Stability Design Method by Power Integrity Analysis," J. of the Korea Institute of Electronic Communication Sciences, vol. 9, no. 7, 2014, pp. 753-760. https://doi.org/10.13067/JKIECS.2014.9.7.753
  22. E.-M. Kim and G. M. McColgan, "Effects on return loss due to microstrip line radial bends and via density," 2007 IEEE Antennas and Propagation Society Int. Symp., Honolulu, HI, June 2007, pp. 3101-3104.