References
- D. Cullen, E. Huenger, M. Toben, B. Houghton and K. Johal: A study on interfacial fracture phenomenon of solder joints formed using the electroless nickel/ immersion gold surfaces finish, Proc. IPC works 2000, s03 (2000)
- Y. C. Sohn, and J. Yu: Correlation between interfacial reaction and brittle fracture found in elecroless Ni(P) metallization, J. Microelectro. & Packag. Soc., 12-1, (2005), 41-46
- Z. Mei, M. Kauffmann, A. Eslambolchi and P. Jonson, "Brittle interfacial fracture of PBGA packages on electroless Ni/immersion Au", Proc. 48th Electronics Component and Technology Conference, (1998), 952
- G.M. Wenger, R. J. Coyle, P. P. Solan, J. K. Dorey, C. V. Dodde, R. Erich and A. Primavera, "Case studies of brittle interfacial fractures in area array solder intercommnects", Proc. 26th International Symposium for testing and failure analysis, (2000), 355
- T. I. Eijim, D. B. Hollesen, A. Holliday, S. A. Gahr and R. J. Coyle: Assembly and reliability of thermally enhanced high I/O BGA packages, Proc. 21th IEEE International Electronics Manufacturing Symposium, (1997), 25
- J. W. Jang, D. R. Frear, T. Y. Lee and K. N. Tu: Morpholgy of interfacial reaction between lead-free solders and electroless Ni-P under bump metallization, J. Appl. Phys., 88-11 (2000), 6359 https://doi.org/10.1063/1.1321787
- D. Goyal, T. Lane, P. Kinzie, C. Panichas, K. M. Chong and O. Villalobos: Failure mechanism of brittle solder joint fracture in the presence of electroless Ni immersion gold (ENIG) interface, Proc. 52nd Electronic Component and Technology Conference, (2002), 732
- K. Zeng, R. Stierman, D. Abbott and M. Murtuza: The root cause of black pad failure of solder joints with electroless Ni/immersion gold plating, JOM, (2006), 75-79
- D. G. Lee, T. J. Chung, J. W Choi, S. H. Huh, S. J. Cho, Y. J. Yoon and B. Y. Min: New surface finish of the substrate for the flip chip packaging, SEMICON Korea 2007, (2007), 255-259
- K. Pun, P. L. Eu, M. N. Islam and C. Q. Cui: Effect of Ni layer thickness on intermetallic formation and mechanical strength of Sn-Ag-Cu solder joint, 10th Electronics Packaging Technology Conference, IEEE, (2008), 487-493
- D. J. Lee, S. H. Huh, S. J. Mun, C. Kang, J. W. Choi, C. S. Kim, S. H. Hwang, J. Y. Pang, H. S. Chu and H. J. Lee: Corrosion behavior of electroless nickel/immersion gold plating by interfacial morphology, Electron. Mater. Lett., in progress
- S. H. Huh, K. D. Kim and K. S. Kim: A novel high speed shear test for lead free flip chip package, Electron. Mater. Lett., 8-1 (2012), 53-58 https://doi.org/10.1007/s13391-011-0510-3
- R. Augustin, R. Kolenak, M. Martinkovic, and M. Provaznik: Influence of 0.1%Al on the properties of the SAC405 lead-free solder alloy, Proc. World Congress on Engineering 2012, (2012), On-line
- K. W. Moon, W. J. Boettinger, U. R. Kattner, F. S. Biancaniello, and C. A. Handwerker: Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys, J. Electron. Mater., 29 (2000), 1122-1236 https://doi.org/10.1007/s11664-000-0003-x
- P. Limayel, R. Labiel, B. Vandeveldel, D. Vandepitte, and B. Verlinden: Creep behavior of mixed SAC405/ SnPb soldered assemblies in shear loading, 9th Electronics Packaging Technology Conference, Singapore, (2007), 703-712
- M. H. Park, E. J. Kwon, H. B. Kang, S. B. Jung, and C. W. Yang: TEM study on the interfacial reaction between electroless plated Ni-P/Au UBM and Sn-3.5Ag solder, Metals and Materials international, 13 (2007), 235-238 https://doi.org/10.1007/BF03027811
- J. W. Yoon, J. W. Kim, J. M. Koo, S. S. Ha, B. I. Noh, W. C. Moon, J. H. Moon, and S. B. Jung: Flipchip bonding technology and reliability of electronic packaging, J. KWJS, 25 (2007), 6-15
- I. Y. Lee, C. B. Lee, S. B. Jung, and C. J. Seo: Growth kinetics of intermetallic compound on Sn-3.5Ag/Cu, Ni pad solder joint with isothermal aging, J. KWS, 20 (2002), 97-102
- C. B. Lee, C. Y. Lee, C. J. Seo, and S. B. Jung: The growth kinetics of intermetallic compound layer in lead-free solder joints, J. KWS, 20 (2002), 16-23
- S. S. Ha, J. W. Kim, J. H. Chae, W. C. Moon, T. H. Hong, C. S. Yoo, J. H. Moon, and S. B. Jung: Thermo-mechanical reliability of lead-free surface mount assemblies for auto-mobile application, J. KWS, 24 (2006), 21-27
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