반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

다구찌법에 의한 STD11의 와이어방전가공에서 표면거칠기에 관한 연구

A Study on Surface Roughness in Wire Electrical Discharge Machining of STD11 based on Taguchi method

  • 최만성 (한국기술교육대학교 메카트로닉스공학부)
  • Choi, Man Sung (School of Mechatronics Engineering, Korea University of Technology and Education)
  • 투고 : 2014.08.01
  • 심사 : 2014.08.29
  • 발행 : 2014.09.30
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초록

The experimental analysis presented aims at the selection of the most optimal machining parameter combination for wire electrical discharge machining (WEDM) of STD11. Based on the Taguchi experimental design ($L_{27}$ orthogonal array) method, a series of experiments were performed by considering time-on, voltage, time-off, wire speed, and flow rate as input parameters. The surface roughness was considered responses. Based on the signal-to-noise (S/N) ratio, the influence of the input parameters on the responses was determined. The optimal machining parameters setting for the minimum surface roughness was found using Taguchi methodology. In order to investigate the effects of process parameters on the surface machined by WEDM, Several experiments are conducted to consider effects of time-on, voltage, time-off, wire speed and flow rate on the surface roughness. Analysis of variance (ANOVA) as well as regression analysis are performed on experimental data. The best results of surface roughness were obtained at higher voltage, lower wire speed, and lower time-on.

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참고문헌

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