Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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A study on the Additive Decomposition Generated during the Via-Filling Process

Via-Filling 공정시 발생하는 첨가제 분해에 관한 연구

  • Lee, Min Hyeong (Department of Advanced Materials Engineering, Korea Polytechnic University) ;
  • Cho, Jin Ki (Department of Advanced Materials Engineering, Korea Polytechnic University)
  • 이민형 (한국산업기술대학교, 신소재공학과) ;
  • 조진기 (한국산업기술대학교, 신소재공학과)
  • Received : 2013.08.19
  • Accepted : 2013.08.28
  • Published : 2013.08.31
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Abstract

The defect like the void or seam is frequently generated in the PCB (Printed Circuit Board) Via-Filling plating inside via hole. The organic additives including the accelerating agent, inhibitor, leveler, and etc. are needed for the copper Via-Filling plating without this defect for the plating bath. However, the decomposition of the organic additive reduces the lifetime of the plating bath during the plating process, or it becomes the factor reducing the reliability of the Via-Filling. In this paper, the interaction of each organic additives and the decomposition of additive were discussed. As to the accelerating agent, the bis (3-sulfopropyl) disulfide (SPS) and leveler the Janus Green B (JGB) and inhibitor used the polyethlylene glycol 8000 (PEG). The research on the interaction of the organic additives and decomposition implemented in the galvanostat method. The additive decomposition time was confirmed in the plating process from 0 Ah/l (AmpereHour/ liter) to 100 Ah/l with the potential change.

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References

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  1. Effects of Leveler Concentration in High Aspect Ratio Via Filling in 3D SiP vol.58, pp.2, 2017, https://doi.org/10.2320/matertrans.MA201607