DOI QR코드

DOI QR Code

Evaluation of IC Electromagnetic Conducted Immunity Test Methods Based on the Frequency Dependency of Noise Injection Path

Noise Injection Path의 주파수 특성을 고려한 IC의 전자파 전도내성 시험 방법에 관한 연구

  • Kwak, SangKeun (Department of Semiconductor Systems Engineering, Sungkyunkwan University) ;
  • Kim, SoYoung (Department of Semiconductor Systems Engineering, Sungkyunkwan University)
  • 곽상근 (성균관대학교 반도체시스템공학과) ;
  • 김소영 (성균관대학교 반도체시스템공학과)
  • Received : 2012.09.04
  • Accepted : 2013.03.05
  • Published : 2013.04.30

Abstract

In this paper, Integrated circuit(IC) electromagnetic(EM) conducted immunity measurement and simulation using bulk current injection(BCI) and direct power injection(DPI) methods were conducted for 1.8 V I/O buffers. Using the equivalent circuit models developed for IC electromagnetic conducted immunity tests, we investigated the reliability of the frequency region where IC electromagnetic conducted immunity test is performed. The insertion loss for the noise injection path obtained from the simulation indicates that using only one conducted immunity test method cannot provide reliable conducted immunity test for broadband noise. Based on the forward power results, we analyzed the actual amount of EM noise injected to IC. We propose a more reliable immunity test methods for broad band noise.

본 논문에서는 IC(Integrated Circuit) 전자파 전도내성 시험 방법인 BCI(Bulk Current Injection)와 DPI(Direct Power Injection)를 이용하여 1.8 V I/O 버퍼에 대한 IC 전자파 전도내성을 시험하였다. IC 전자파 전도내성 시험을 회로 해석기를 사용하여 시뮬레이션 할 수 있는 등가회로 모델(model)을 개발하고 검증하였다. BCI와 DPI의 주파수에 따른 forward 전력을 비교한 결과는 주파수 성분에 따라 실제 IC에 도달하는 전자파(electromagnetic, EM) 노이즈의 양이 제한됨을 보여준다. 시뮬레이션을 통해, 가해지는 RF(Radio Frequency) 노이즈가 전달되는 경로의 삽입손실을 구하여, 하나의 시험 방법만으로는 넓은 주파수 영역에서 실질적인 IC 전자파 내성시험의 어려움을 발견하였다. 따라서 규정된 시험 방법을 보완하여 넓은 주파수 영역의 노이즈에 대해 신뢰도 높은 IC 전자파 전도내성 시험 방법을 제안한다.

Keywords

References

  1. IET Electrical Measurement Series 8, A Handbook for EMC Testing and Measurement, London, United Kingdom, 1996.
  2. IEC 62132, Ed.1: Integrated Circuit-Measurements of electromagnetic Immunity - 150 kHz to 1 GHz.
  3. IEC 62132-3, Ed.1: Integrated Circuit - Measurements of Electromagnetic Immunity - 150 kHz to 1 GHz, Part 3: Bulk Current Injection (BCI) Method.
  4. IEC 62132-4, Ed.1: Integrated Circuit - Measurements of Electromagnetic Immunity - 150 kHz to 1 GHz, Part 4: Direct RF Power Injection(DPI) Method.
  5. AN10897, A Guide to Designing for ESD and EMC, NXP, Jan. 2010.
  6. F. Lafon, F. D. Daran, M. Ramdani, R. Perdriau, and M. Drissi, "Immunity modeling of integrated circuits: An industrial case", IEICE Transactions on Communications, vol. E93-B, no. 7, pp. 1723-1730, Jul. 2010. https://doi.org/10.1587/transcom.E93.B.1723
  7. MIL-STD-461E: Requirements for the Control of Electromagnetic Interference Characteristics of Subsystems and Equipment, p. 23, Aug. 1999.
  8. SangKeun Kwak, JeongMin Jo, SeokSoon No, Hye Sook Lee, and SoYoung Kim, "Bulk current injection test modeling using equivalent circuit for 1.8 V mobile ICs", in Proc. APEMC, Singapore, pp. 565-568, May 2012.
  9. SangKeun Kwak, SeokSoon No, KyuJin Kim, Wansoo Nah, and SoYoung Kim, "Equivalent circuit modeling of bulk current injection probe", Korea-Japan EMT/EMC/BE Joint Conference, Seoul, May 2012.
  10. Bo Pu, JaeJoong Lee, SangKeun Kwak, SoYoung Kim, and Wansoo Na, "Electromagnetic susceptibility analysis of ICs using DPI method with consideration of PDN", in Proc. APEMC, Singapore, pp. 77-80, May 2012.
  11. Stephen H. Hall, et al., Advanced Signal Integrity for High-Speed Digital System Design, Hoboken, NJ : John Wiley & Sons, 2009.
  12. N. Delorme, M. Belleville, and J. Chilo, "Inductance and capacitance analytic formulas for VLSI interconnects", Electronic Letters, 23rd, vol. 32, no. 11, May 1996.
  13. www.mentor.com.
  14. I. Chahine, M. Kadi, E. Gaboriaud, A. Louis, and B. Mazari, "Characterization and modeling of the susceptibility of integrated circuits to conducted electromagnetic disturbances up to 1 GHz", IEEE Trans. Electromagn. Compat., vol. 50, no. 2, pp. 285-293, May 2008. https://doi.org/10.1109/TEMC.2008.918983

Cited by

  1. BCI Probe Emulator Using a Microstrip Coupler vol.25, pp.11, 2014, https://doi.org/10.5515/KJKIEES.2014.25.11.1164