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Processing Evaluations of the Eagle Glass Cutting Using Pico-second Laser

피코초 레이저를 이용한 Eagle Glass 절단 시 가공성 평가

  • Lee, Sang Kyun (Department of Mechanical Engineering, Inha Univ.) ;
  • Lee, Young Gon (Department of Mechanical Engineering, Inha Univ.) ;
  • Kim, Jae Do (Department of Mechanical Engineering, Inha Univ.)
  • Received : 2012.05.04
  • Accepted : 2013.01.03
  • Published : 2013.04.01

Abstract

In this paper, the characteristics of ablation processing of the eagle glass by pico-second laser are investigated. The laser ablation is used to process micro forms on materials. The ablation causes little thermal effect and little burr on the surface of eagle glass. In order to examine the characteristics of panic cracks, experiments are conducted under various cutting conditions such as a frequency of 600 kHz, laser powers, scan speeds and number of scan(NS). To minimize the panic cracks, the specimens are heated at $30^{\circ}C$, $45^{\circ}C$, and $60^{\circ}C$ for ten minutes respectively and then they are broken by hands. Laser powers, NS and scan speeds have an effect on glass cutting results. The ablation depths increase with an increase in the laser power and NS whereas the panic cracks decrease with an increase in scan speed. The high temperature on processed specimens reduces the panic cracks and makes good results of laser cutting. The optimal condition for eagle glass laser cutting is found to be at 30 W of laser power, 3 mm/s of scan speed and 500 of NS, respectively.

Keywords

References

  1. Yang, L. J., Wang, Y., Tian, Z. G., and Cai, N., "YAG laser cutting soda-lime glass with controlled fracture and volumetric heat absorption," International Journal of Machine Tools & Manufacture, Vol. 50, pp. 849-859, 2010. https://doi.org/10.1016/j.ijmachtools.2010.07.001
  2. Kim, P. J., "Cutting characteristic of polarizer film by $CO_{2}$ laser," M.Sc. Thesis, Mechanical Engineering, Inha Univ., 2010.
  3. Momma, C., Nolte, S., Chichkov, B. N., Alvensleben, F. V., and Tunnermann, A., "Precise laser ablation with ultrashort pulses," Applied Surface Science, Vol. 109, pp. 15-19, 1997.
  4. Fermann, M. E., Galvanauskas, A., and Sucha, G., "Ultrafast Lasers: Technology and Applications," Marcel Dekker, 2003.
  5. Shin, D. S., Suh, J., Lee, J. H., Kim, K. H., and Paik, B. M., "Picosecond laser drilling of silicon wafer for 3D-TSV," Proc. of KSPE Autumn Conference, pp. 701-702, 2009.