Transactions of the Korean Society for Noise and Vibration Engineering (한국소음진동공학회논문집)

The Korean Society for Noise and Vibration Engineering (한국소음진동공학회)
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2D and 3D Topology Optimization with Target Frequency and Modes of Ultrasonic Horn for Flip-chip Bonding

플립칩 접합용 초음파 혼의 목표 주파수와 모드를 고려한 2차원 및 3차원 위상최적화 설계

  • Ha, Chang Yong (Department of Mechanical and Information Engineering, University of Seoul) ;
  • Lee, Soo Il (Department of Mechanical and Information Engineering, University of Seoul)
  • Received : 2012.11.19
  • Accepted : 2012.12.03
  • Published : 2013.01.20
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Abstract

Ultrasonic flip-chip bonding needs a precise bonding tool which delivers ultrasonic energy into chip bumps effectively to use the selected resonance mode and frequency of the horn structure. The bonding tool is excited at the resonance frequency and the input and output ports should locate at the anti-nodal points of the resonance mode. In this study, we propose new design method with topology optimization for ultrasonic bonding tools. The SIMP(solid isotropic material with penalization) method is used to formulate topology optimization and OC(optimal criteria) algorithm is adopted for the update scheme. MAC(modal assurance criterion) tracking is used for the target frequency and mode. We fabricate two prototypes of ultrasonic tools which are based on 3D optimization models after reviewing 2D and 3D topology optimization results. The prototypes are satisfied with the ultrasonic frequency and vibration amplitude as the ultrasonic bonding tools.

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References

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  1. Vibration Characteristics of a Wire-Bonding Ultrasonic Horn vol.38, pp.2, 2014, https://doi.org/10.3795/KSME-A.2014.38.2.227