Atomic Layer Deposition for Displays Applications

  • 최동원 (한양대학교 신소재공학부) ;
  • 박진성 (한양대학교 신소재공학부)
  • Published : 2013.10.31

Abstract

Keywords

References

  1. T. Suntola, Mater. Sci. Rep., 4 261 (1989). https://doi.org/10.1016/S0920-2307(89)80006-4
  2. J. S. Park, W-J. Maeng, H. S. Kim and J-S. Park, Thin Solid Film 520 1679 (2012). https://doi.org/10.1016/j.tsf.2011.07.018
  3. J-S. Park, H. Kim, and I. D. Kim, J. Electroceram. DOI 10.1007/s10832-013-9858-0 (2013)
  4. Y. Q. Fu, J. K. Luo, X. Y. Du, A. J. Flewitt, Y. Li, G. H. Markx, A. J. Walton, W.I. Milne Sensors and Actuators B: Chemical 143 606 (2010) https://doi.org/10.1016/j.snb.2009.10.010
  5. Q. Cao and J. A. Rogers, Adv. Mater. 21 29 (2009) https://doi.org/10.1002/adma.200801995
  6. J-S. Park, J. K. Jeong, H-J. Chung, Y-G. Mo, and H. D. Kim, Appl. Phys. Lett. 92 072104 (2008) https://doi.org/10.1063/1.2838380
  7. D. Kang, H. Lim, C. Kim, I. Song, J. Park, Y. Park, and J. G. Chung, Appl. Phys. Lett. 90 192101 (2007) https://doi.org/10.1063/1.2723543
  8. S-I. Kim, S. W. Kim, C. J. Kim, and J-S. Park, J. Electrochem. Soc. 158 H115 (2011) https://doi.org/10.1149/1.3519987
  9. J. Lee, J-S. Park, Y. S. Pyo, D. B. Lee, E. H. Kim, D. Stryakhilev, T. W. Kim, D. U. Jin, and Y-G. Mo, Appl. Phys. Lett. 95 123502 (2009) https://doi.org/10.1063/1.3232179
  10. J. K. Jeong, H. W. Yang, J. H. Jeong, Y-G. Mo, and H. D. Kim, Appl. Phys. Lett. 93 123508 (2008) https://doi.org/10.1063/1.2990657
  11. S. H. K. Park, M-K. Ryu, H. Oh, C-S. Hwang, J-H. Jeon, S-M. Yoon, JVST B 31 020601 (2013)
  12. J-S. Park, H. Chae, H. K. Chung, and S. I. Lee, Semicond. Sci. Technol. 26 034001 (2011) https://doi.org/10.1088/0268-1242/26/3/034001
  13. P. E. Burrows et al. Proc. SPIE 75 4105 (2001)
  14. A. S. Silva Sobrinho, G. Czeremuszkin, M. Latrache, and M. R. Wertheimer, J. Vac. Sci. Technol. A 18 149 (2000) https://doi.org/10.1116/1.582156
  15. A. G. Erlat, B. M. Henry, J. J. Ingram, D. B. Mountain, A. McGuigan, R. P. Howson, C. R. M. Grovenor, G. A. D. Briggs, and Y. Tsukahara, Thin Solid Films 388 78 (2001) https://doi.org/10.1016/S0040-6090(01)00836-7
  16. D-W. Choi, S-J. Kim, J. H. Lee, K-B. Chung, J-S. Park, Curret Applied Physics 12 S19 (2012) https://doi.org/10.1016/j.cap.2012.02.012
  17. J. Meyer, P. Gorn, F. Bentram, S. Hamwi, T. Winkler, H-H. Johannes, T. Weimann, P. Hinze, T. Ridel,and W. Kowalsky, Adv. Mater. 21 1845 (2009) https://doi.org/10.1002/adma.200803440
  18. A. A. Dameron, S. D. Davidson, B. B. Burton, P. F. Carcia, R. S. Mclean, and S. M. George, J. Phys. Chem. C. 112 4573 (2008)
  19. M. Park, S. Oh, H. Kim, D. Jung, D-W. Choi, J-S. Park, Thin Solid Films 546 153 (2013). https://doi.org/10.1016/j.tsf.2013.05.017
  20. T-H. Jung, J-S. Park, D-H. Kim, Y. Jeong, S-G. Park, and J-D. Kwon, J. Vac. Sci. Technol. A 31 01A124 (2013).
  21. W. J. Maeng, J-W. Lee, J. H. Lee, K-B. Chung, and J-S. Park, J. Phys. D: Appl. Phys. 44 445305 (2011). https://doi.org/10.1088/0022-3727/44/44/445305
  22. W. J. Maeng and J-S. Park, J. Electroceram. DOI 10.1007/s10831-013-9848-2 (2013).
  23. S. C. Gong, J. G. Jang, H. J. Chang, J-S. Park, Synthetic Metals 161 823 (2011). https://doi.org/10.1016/j.synthmet.2011.02.007