References
- Weihs, T. P., Hong, S., Bravman, J. C. and Nix, W. D., 1988, "Mechanical Deflection of Cantilever Microbeams: a New Technique for Testing the Mechanical Properties of Thin Films," J Mater Res, Vol.3, pp.931-942. https://doi.org/10.1557/JMR.1988.0931
- Schweitz, J. A., 1992, "Mechanical Characterization of Thin Films by Micromechanical Techniques," MRS Bull, XVII, pp.34-45.
- Beams, J. W., 1959, Structure and Properties of Thin Films, New York: Wiley, pp.183-192.
- Bromley, E. I., Randall, J. N., Flanders, D. C. and Mountain, R. W., 1983, "A Technique for the Determination of Stress in Thin Films," J Vac Sci Technol B, Vol.1, pp.1364-1366. https://doi.org/10.1116/1.582744
- Tsuchiya, T., Tabata, O., Sakata, J. and Taga, Y., 1998, "Specimen Size Effect on Tensile Strength of Surface Micromachined Polycrystalline Silicon Thin Films," J Microelectromech Syst, Vol.7, pp.106-113. https://doi.org/10.1109/84.661392
- Sharpe, W. N., Yuan, B. and Edwards, R. L., 1997, "A New Technique for Measuring the Mechanical Properties of Thin Films," J Microelectromech Syst, Vol.6, pp.193-199. https://doi.org/10.1109/84.623107
- Greek, S., Ericson, F., Johansson, S., Furtsch, M., Rump, A., 1999, "Micro Characterization of Thick Polysilicon Films: Young's Modulus and Fracture Strength Evaluated with Microstructure," J Micromech Microeng, Vol.9, pp.245-251. https://doi.org/10.1088/0960-1317/9/3/305
- Kim, C. Y., Song, J. H., and Lee, D. Y., 2009, "Development of a Fatigue Testing System for Thin Films," Int J Fatigue, Vol. 31, pp. 736-742. https://doi.org/10.1016/j.ijfatigue.2008.03.010
- Kim, C. Y. and Sharpe, W. N., 2010, "Development of a Fatigue Testing System for Micro-Specimens," Trans. of the KSME (A), Vol. 34, pp. 1201-1207.
- Pan, B., Qiam, K., Xie, H. and Anand, A., 2009, "Two-dimensional Digital Image Correlation for Inplane Displacement and Strain Measurement: A Review," Meas Sci Technol, Vol. 20, pp. 1-17.
- Han, S. W., Lee, S. J., Seo, K. J., Kim, J. H., Lee, H. J., 2006, "Measurement of Young's Modulus and Poisson's Ratio for Copper Thin Film Using Visual Image Tracing Method," Trans. of the KSME 2006, pp. 7-10.
- ASTM E08M-04, 2004, Annual book of ASTM standards, vol. 03.01. Philadelphia (PA), p. 419.
- Hwangbo, Y., Song, J. H., 2010, "Fatigue Life and Plastic Deformation Behavior of Electrodeposited Copper Thin Films," Mater. Sci. Eng. A, Vol. 527, pp. 2222-2232. https://doi.org/10.1016/j.msea.2010.01.016
- ASM Handbook, Vol. 2, Properties & Selection: Nonferrous Alloys and Special Purpose Materials, 1990, ASM International, Materials Park, OH,.
- Klein, M., Hadrboletz, A., Weiss, B., Khatibi, G., 2001, "Size Effect on the Stress-Strain, Fatigue and Fracture Properties of Thin Metallic Foils," Mater. Sci. Eng. A, Vol. 321, pp. 924-928. https://doi.org/10.1016/S0921-5093(01)01043-7
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