한국전기전자재료학회논문지 (Journal of the Korean Institute of Electrical and Electronic Material Engineers)

  • 제25권10호
  • /
  • Pages.849-856
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  • 2012
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  • 1226-7945(pISSN)
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  • 2288-3258(eISSN)
한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
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이중 몰딩에 의한 백색 LED의 광추출 효율 향상

Enhancement of Light Extraction in White LED by Double Molding

  • 장민석 (한국광기술원 신광원조명사업단) ;
  • 김완호 (한국광기술원 신광원조명사업단) ;
  • 강영래 (한국광기술원 신광원조명사업단) ;
  • 김기현 (한국광기술원 신광원조명사업단) ;
  • 송상빈 (한국광기술원 신광원조명사업단) ;
  • 김진혁 (전남대학교 신소재공학부) ;
  • 김재필 (한국광기술원 신광원조명사업단)
  • Jang, Min-Suk (Korea Photonics Technology Institute, New Lighting Solution R&DB Sector) ;
  • Kim, Wan-Ho (Korea Photonics Technology Institute, New Lighting Solution R&DB Sector) ;
  • Kang, Young-Rea (Korea Photonics Technology Institute, New Lighting Solution R&DB Sector) ;
  • Kim, Ki-Hyun (Korea Photonics Technology Institute, New Lighting Solution R&DB Sector) ;
  • Song, Sang-Bin (Korea Photonics Technology Institute, New Lighting Solution R&DB Sector) ;
  • Kim, Jin-Hyuk (School of Materials Science & Engineering, Chonnam University) ;
  • Kim, Jae-Pil (Korea Photonics Technology Institute, New Lighting Solution R&DB Sector)
  • 투고 : 2012.07.30
  • 심사 : 2012.09.19
  • 발행 : 2012.10.01
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초록

Chip on board type white light emitting diode on metal core printed circuit board with high thixotropy silicone is fabricated by vacuum printing encapsulation system. Encapsulant is chosen by taking into account experimental results from differential scanning calorimeter, shearing strength, and optical transmittance. We have observed that radiant flux and package efficacy are increased from 336 mW to 450 mW and from 11.9 lm/W to 36.2 lm/W as single dome diameter is varied from 2.2 mm to 2.8 mm, respectively. Double encapsulation structure with 2.8 mm of dome diameter shows further significant enhancement of radiant flux and package efficacy to 667 mW and 52.4 lm/W, which are 417 mW and 34.8 lm/W at single encapsulation structure, respectively.

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