참고문헌
- J. H. Kong and C. S. Xie, Mater. Design 27, 1169 (2006). https://doi.org/10.1016/j.matdes.2005.02.006
- J. Calvo, I-H. Jung, A. M. Elwazri, D. Bai, and S. Yue, Mater. Sci. Eng. A520, 90 (2009).
- A. Abdollah-Zadeh and B. Eghbali, Mater. Sci. Eng. A457, 219 (2007).
- S. Gunduz and M. Acarer, Mater. Design 27, 1076 (2006). https://doi.org/10.1016/j.matdes.2005.01.020
- S.-J. Lee and Y.-K. Lee, Scr. Mater. 52, 973 (2005). https://doi.org/10.1016/j.scriptamat.2005.01.028
- J. S. Park and Y. K. Lee, Scr. Mater. 57, 109 (2007). https://doi.org/10.1016/j.scriptamat.2007.03.041
- F. Xiao, B. Liao, Y. Shan, and K. Yang, Mater. Charact. 54, 417 (2005). https://doi.org/10.1016/j.matchar.2005.01.007
- Y. Kayali, S. Taktak, S. Ulu, and Y. Yalcin, Mater. Design 31, 1799 (2010). https://doi.org/10.1016/j.matdes.2009.11.017
- C. Bindal and A. H. Ucisik, J. Aust. Ceram. Soc. 34, 287 (1998).
- G. Stergioudis, Cryst. Res. Technol. 41, 1002 (2006). https://doi.org/10.1002/crat.200610711
- H.-J. Hunger and G. Lobig, Thin Solid Films 310, 244 (1997). https://doi.org/10.1016/S0040-6090(97)09514-X
- L. B. Sipahi, M. R. Govindaraj, D. C. Jiles, P. K. Liaw, and D. S. Drinon, Rev. Progress in Quantitative Nondestructive Eval. 13, 1801 (1994).
- D. G. Park, E. J. Moon, D. J. Kim, S. H. Chi, and J. H. Hong, Physica B327, 315 (2003).
- D. G. Park, J. H. Hong, I. S. Kim, and H. C. Kim, J. Mater. Sci. 32, 6141 (1997). https://doi.org/10.1023/A:1018608321067
- J. A. Vaccari, Des. Eng. 52, 53 (1981).
- R. Gopalan, Y. M. Chen, T. Ohkubo, and K. Hono, Scr. Mater. 61, 544 (2009). https://doi.org/10.1016/j.scriptamat.2009.05.022
- L. K. Varga, F. Mazaleyrat, J. Kovac, and A. Kakay, Mater. Sci. Eng. A304-306, 946 (2001).
- B. Weglinski and J. Kaczmar, Powder Metall. 23, 210 (1980). https://doi.org/10.1179/pom.1980.23.4.210
- P. Ripka, M. Butta, M. Malatek, S. Atalay, and F. E. Atalay, Sens. Actuators: A145-146, 23 (2008).
- L. L. Qian and G. A. Stone, J. Mater. Perform. 4, 59 (1995). https://doi.org/10.1007/BF02682706
- O. Knotek, E. Lugscheider, and K. Leuschen, Thin Solid Films 45, 331 (1977). https://doi.org/10.1016/0040-6090(77)90266-8
- H. Kemi, C. Sasaki, M. Kitamura, N. Satomi, Y. Ueda, and M. Nishikawa, J. Nuclear Mater. 26, 1108 (1999).
- T. W. Spence and M. M. Makhlouf, J. Mater. Proc. Technol. 168, 127 (2005).
- V. Jain and G. Sundararajan, Surf. Coat. Technol. 149, 21 (2002). https://doi.org/10.1016/S0257-8972(01)01385-8
- C. W. Chen, Magnetism and Metallurgy of Soft Magnetic Materials, North-Holland, Amsterdam (1977).
- S. Sen, M. Usta, C. Bindal, and A. H. Ucisik, Korean J. Ceram. 6, 27 (2000).
- A. K. Sinha, Boriding (Boronizing). In: ASM Materials Handbook 4, ASM International, Materials Park (1991) p 437.
- A. S. Dehlinger, J. F. Pierson, A. Roman, and P. H. Bauer, Surf. Coat. Technol. 174-175, 331 (2003). https://doi.org/10.1016/S0257-8972(03)00399-2
- L. S. Dorneles, M. Venkatesan, M. Moliner, J. G. Lunney, and J. M. D. Coey, Appl. Phys. Lett. 85, 6377 (2004). https://doi.org/10.1063/1.1840113
- I. Akkurt, A. Calik, and H. Akyildirim, Nucl. Eng. Des. 241, 55 (2011). https://doi.org/10.1016/j.nucengdes.2010.10.009