센서학회지 (Journal of Sensor Science and Technology)

  • 제21권1호
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  • Pages.34-38
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  • 2012
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  • 1225-5475(pISSN)
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  • 2093-7563(eISSN)
한국센서학회 (The Korean Sensors Society)
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BeCu 금속박판을 이용한 테스트 소켓 제작

Fabrication of Test Socket from BeCu Metal Sheet

  • 김봉환 (대구가톨릭대학교 전자공학과)
  • Kim, Bong-Hwan (Department of Electronics Engineering, Catholic University of Daegu)
  • 투고 : 2011.10.13
  • 심사 : 2011.11.27
  • 발행 : 2012.01.24
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초록

We have developed a cost effective test socket for ball grid array(BGA) integrated circuit(IC) packages using BeCu metal sheet as a test probe. The BeCu furnishes the best combination of electrical conductivity and corrosion resistance. The probe of the test socket was designed with a BeCu cantilever. The cantilever was designed with a length of 450 ${\mu}m$, a width of 200 ${\mu}m$, a thickness of 10 ${\mu}m$, and a pitch of 650 ${\mu}m$ for $11{\times}11$ BGA. The fabrication of the test socket used techniques such as through-silicon-via filling, bonding silicon wafer and BeCu metal sheet with dry film resist(DFR). The test socket is applicable for BGA IC chip.

키워드

참고문헌

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