References
- A. Chini, D. Buttari, R. Coffie, S. Heikman, S. Keller, and U. K. Mishra, Electron. Lett 40, 73 (2004) [DOI: 10.1049/el:20040017].
- Y. F. Wu, A. Saxler, M. Moore, R. P. Smith, S. Sheppard, P. M. Chavarkar, T. Wisleder, U. K. Mishra, and P. Parikh, IEEE Electron Device Lett. 25, 117 (2004) [DOI: 10.1109/LED.2003.822667].
- A. Khaligh and A. Emadi, J. Electr. Eng. Technol. 1, 63 (2006). https://doi.org/10.5370/JEET.2006.1.1.063
- X. Huili, Y. Dora, A. Chini, S. Heikman, S. Keller, and U. K. Mishra, IEEE Electron Device Lett. 25, 161 (2004) [DOI: 10.1109/LED.2004.824845].
- C. Yong, Z. Yugang, K. J. Chen, and K. M. Lau, IEEE Electron Device Lett. 26, 435 (2005) [DOI: 10.1109/LED.2005.851122].
- L. Yuan, M. Wang, and K. J. Chen, Physica Status Solidi (c) 6, S944 (2009) [DOI: 10.1002/pssc.200880776]
- F. Medjdoub, M. Alomari, J. F. Carlin, M. Gonschorek, E. Feltin, M. A. Py, C. Gaquiere, N. Grandjean, and E. Kohn, Electron. Lett 44, 696 (2008) [DOI: 10.1049/el:20080864].
- O. Ambacher, J. Smart, J. R. Shealy, N. G. Weimann, K. Chu, M. Murphy, W. J. Schaff, L. F. Eastman, R. Dimitrov, L. Wittmer, M. Stutzmann, W. Rieger, and J. Hilsenbeck, J. Appl. Phys. 85, 3222 (1999) [DOI: 10.1063/1.369664].
- F. Sacconi, A. Di Carlo, P. Lugli, and H. Morkoc, IEEE Trans. Electron Dev. 48, 450 (2001) [DOI: 10.1109/16.906435].
- Yong Cai, Yugang Zhou, Lau, K.M. and Chen, K.J, IEEE Trans. Electron Dev. 53, 2207 (2006) [DOI: 10.1109/TED.2006.881054].
Cited by
- Optimization of Ohmic Contact Metallization Process for AlGaN/GaN High Electron Mobility Transistor vol.14, pp.1, 2013, https://doi.org/10.4313/TEEM.2013.14.1.32
- Improved planar device isolation in AlGaN/GaN HEMTs on Si by ultra-heavy 131 Xe+ implantation vol.214, pp.8, 2017, https://doi.org/10.1002/pssa.201600794