마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제18권1호
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  • Pages.7-13
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  • 2011
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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광 PCB 및 패키징 기술

Optical PCB and Packaging Technology

  • 류진화 (부산대학교 나노융합기술학과) ;
  • 김동민 (부산대학교 차세대전자기판회로학과) ;
  • 김응수 (부산외국어대학교 디지털미디어학부) ;
  • 정명영 (부산대학교 WCU 인지메카트로닉스공학과)
  • 투고 : 2011.02.28
  • 심사 : 2011.03.15
  • 발행 : 2011.03.31
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초록

According to increasing of data transfer rate, printed circuit board (PCB) is required improvement of transmission speed. Optical PCB and its packaging technology can be one of the solutions that overcome the limitations of conventional electrical PCB. The data transmission capacity will be increased 10 Tbps at 2015. To this end, studies on various OPCB technologies are being conducted. For cost-effective and high- performance OPCB, studies of optical coupling by polymer replication process are conducted. In this work, optical waveguide and optical fiber array block were sequentially fabricated by polymer pattern replication method. Using this method we successfully demonstrate low loss optical fiber coupling between optical waveguide and optical fiber arrays. And researches on flip chip bonding process and using electro-optic connectors for packaging are conducted.

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참고문헌

  1. M. H. Jeong, J. M. Kim, S. H. Yoo, C. W. Lee, and Y. B. Park, "Effect of PCB surface finishs on intermetallic compound growth kinetics of Sn-3.0Ag-0.5Cu solder bump", J. Microelectron. Packag. Soc., 17, 81 (2010).
  2. S. J. Ryu, "Comparison of PCB surface treatment effect using UV equipment and atmospheric pressure plasma equipment", J. Microelectron. Packag. Soc., 16(3), 53 (2009).
  3. W. J. Lee, S. H. Hwang, J. W. Lim, and B. S. Rho, "Polymeric waveguide film with embedded mirror for multilayer optical circuits", IEEE Photon. Technol. Lett. 21, 12 (2009). https://doi.org/10.1109/LPT.2008.2007970
  4. X. Dou, X. Wang, H. Huang, X. Lin, D. Ding, D. Z. Pan, and R. T. Chen, "Polymeric waveguides with embedded micro-mirrors formed by metallic hard mold", Opt. Express 18, 378 (2009).
  5. J. Wu, J. Wu, J. Bae, and X. Wu, "Soft- lithography-based optical interconnection with high misalignment tolerance", Opt. Express 13, 6259 (2005). https://doi.org/10.1364/OPEX.13.006259
  6. H. L. Hsiao, H. C. Lan, C. C. Chang, C. Y. Lee, S. P. Chen, C. H. Hsu, S. F. Chang, Y. S. Lin, F. M. Kuo, J. W. Shi, and M. L. Wu, "Compact and passive-alignment 4-channel x 2.5-Gbps optical interconnect modules based on silicon optical benches with $45^{\circ}$ micro-reflectors", Opt. Express 17, 24250 (2009). https://doi.org/10.1364/OE.17.024250
  7. J. H. Ryu, T. H. Lee, S. H. Oh, S. U. Cho, C. S. Kim, and M. Y. Jeong, "Imprinted optical device and its reliability", Cur. Appl. Phys. 9, e7 (2009). https://doi.org/10.1016/j.cap.2008.12.022
  8. J. H. Ryu, T. H. Lee, I. K. Cho, C. S. Kim, and M. Y. Jeong, "Simple fabrication of a double-layer multi-channel optical waveguide using passive alignment", Opt. Express 19, 1183 (2011). https://doi.org/10.1364/OE.19.001183
  9. N. W. Kim, K. W. Kim and H. C. Sin, "A Viscoelasitc finite element analysis of thermal nanoimprint lithography process", J. Microelectron. Packag. Soc., 14(4), 1 (2007).
  10. J. T. Kim, K. B. Yoon, and C. G. Choi, "Passive alignment method of polymer PLC devices by using a hot embossing technique", IEEE Photon. Technol. Lett. 16, 1664 (2004). https://doi.org/10.1109/LPT.2004.828355
  11. R. V. Penty, N. Bamiedakis, A. Hashim, I. H. White, "Polymer waveguide integrated circuits", 15th OptoElectronics and Communications Conference (OECC 2010), 6E2-1, (July 2010).
  12. N. Bamiedakis, J. Beals IV, A. H. Hashim, R. V. Penty, and I. H. White, "Optical transceiver integrated on PCB using electro-optic connectors compatible with pick-and-place assembly technology", in Optoelectronic Interconnects and Component Integration IX, 760700, (2010).
  13. A. Hashim, N. Bamiedakis, R. V. Penty, and I. H. White, "Low-cost 10 Gb/s Chip-to-chip Optical Interconnect", ECOC 2010, P3.21, (September 2010).