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A High Performance Co-design of 26 nm 64 Gb MLC NAND Flash Memory using the Dedicated NAND Flash Controller

  • You, Byoung-Sung (Head of Advanced Flash Design Team, Flash Development Division, Hynix Semiconductor Inc.) ;
  • Park, Jin-Su (Head of Advanced Flash Design Team, Flash Development Division, Hynix Semiconductor Inc.) ;
  • Lee, Sang-Don (Head of Advanced Flash Design Team, Flash Development Division, Hynix Semiconductor Inc.) ;
  • Baek, Gwang-Ho (Head of Advanced Flash Design Team, Flash Development Division, Hynix Semiconductor Inc.) ;
  • Lee, Jae-Ho (Head of Advanced Flash Design Team, Flash Development Division, Hynix Semiconductor Inc.) ;
  • Kim, Min-Su (Head of Advanced Flash Design Team, Flash Development Division, Hynix Semiconductor Inc.) ;
  • Kim, Jong-Woo (Head of Advanced Flash Design Team, Flash Development Division, Hynix Semiconductor Inc.) ;
  • Chung, Hyun (Head of Advanced Flash Design Team, Flash Development Division, Hynix Semiconductor Inc.) ;
  • Jang, Eun-Seong (Head of Advanced Flash Design Team, Flash Development Division, Hynix Semiconductor Inc.) ;
  • Kim, Tae-Yoon (Head of Advanced Flash Design Team, Flash Development Division, Hynix Semiconductor Inc.)
  • 투고 : 2011.04.29
  • 발행 : 2011.06.30

초록

It is progressing as new advents and remarkable developments of mobile device every year. On the upper line reason, NAND FLASH large density memory demands which can be stored into portable devices have been dramatically increasing. Therefore, the cell size of the NAND Flash memory has been scaled down by merely 50% and has been doubling density each per year. [1] However, side effects have arisen the cell distribution and reliability characteristics related to coupling interference, channel disturbance, floating gate electron retention, write-erase cycling owing to shrinking around 20nm technology. Also, FLASH controller to manage shrink effect leads to speed and current issues. In this paper, It will be introduced to solve cycling, retention and fail bit problems of sub-deep micron shrink such as Virtual negative read used in moving read, randomization. The characteristics of retention, cycling and program performance have 3 K per 1 year and 12.7 MB/s respectively. And device size is 179.32 $mm^2$ (16.79 mm ${\times}$ 10.68 mm) in 3 metal 26 nm CMOS.

키워드

참고문헌

  1. K. Takeuchi et al, "Novel Co-Design of NAND Flash Memory and NAND Flash Controller Circuits for Sub-30 nm Low-Power High-Speed Solid-State Drives (SSD)," IEEE J. Solid-State Circuits, Vol.44, pp.1227-1234, 2009. https://doi.org/10.1109/JSSC.2009.2014027
  2. Changhyuk Lee et al, "A 32Gb MLC NAND Flash Memory with Vth Endurance Enhancing Schemes in 32 nm CMOS," IEEE. Solid-State Circuits Conference, section 24, pp.446-448, 2010. https://doi.org/10.1109/ISSCC.2010.5433932
  3. Yohwan Koh et al, "NAND Flash Scaling beyond 20 nm," Memory Workshop, 2009. IMW '09. IEEE International, pp.1-3, 2009. https://doi.org/10.1109/IMW.2009.5090600

피인용 문헌

  1. Generation Dependence of Retention Characteristics in Extremely Scaled NAND Flash Memory vol.34, pp.9, 2013, https://doi.org/10.1109/LED.2013.2271351
  2. Activation Energies $(E_{a})$ of Failure Mechanisms in Advanced NAND Flash Cells for Different Generations and Cycling vol.60, pp.3, 2013, https://doi.org/10.1109/TED.2013.2241065
  3. Separation of Corner Component in TAT Mechanism in Retention Characteristics of Sub 20-nm NAND Flash Memory vol.35, pp.1, 2014, https://doi.org/10.1109/LED.2013.2288267
  4. Probability Level Dependence of Failure Mechanisms in Sub-20 nm NAND Flash Memory vol.35, pp.3, 2014, https://doi.org/10.1109/LED.2014.2301164
  5. Analysis of read disturbance mechanism in retention of sub-20 nm NAND flash memory vol.54, pp.4S, 2015, https://doi.org/10.7567/JJAP.54.04DD03